Description

Electronic Component Model: SLP4N60S is a high power IC chip that offers a high power to foot print size ratio. It is designed with an all welded construction of the Power Metal Strip® resistors, making it ideal for all types of current sensing, voltage division, and pulse applications. With a proprietary processing technique, this component produces extremely low resistance values, down to 0.0002 Ω. It is also resistant to sulfur and can withstand high sulfur environments. The specially selected and stabilized materials used in this model allow for a high power rating of up to 7 W. The solid metal nickel-chrome or manganese-copper alloy resistive element has a low Temperature Coefficient of Resistance (TCR) of less than 20 ppm/°C. It has a very low inductance ranging from 0.5 nH to 5 nH and low thermal EMF of less than 3 μV/°C. This model is AEC-Q200 qualified and its material categorization complies with industry standards.

Specifications and features

- High power to foot print size ratio

- All welded construction of the Power Metal Strip® resistors

- Extremely low resistance values, down to 0.0002 Ω

- Sulfur resistance by construction

- High power rating of up to 7 W

- Low Temperature Coefficient of Resistance (TCR) of less than 20 ppm/°C

- Very low inductance ranging from 0.5 nH to 5 nH

- Low thermal EMF of less than 3 μV/°C

- AEC-Q200 qualified

- Material categorization compliant

Application Scenarios

- Current sensing

- Voltage division

- Pulse applications

Comparison

- High power to foot print size ratio

- All welded construction for durability

- Extremely low resistance values for accurate measurements

- Sulfur resistance

- High power rating for demanding applications

- Low TCR for stable performance

- Very low inductance for minimizing interference

- Low thermal EMF for reliable operation

- AEC-Q200 qualified for automotive applications

- Material categorization compliant with industry standards

None identified