Description

Electronic Component Model: SS16L R3 is an IC chip in the product category. It has a low profile package and is ideal for automated placement. The component has an ultrafast reverse recovery time, resulting in low power losses and high efficiency. It also has a low forward voltage drop and high surge capability. The model is designed for high-temperature soldering at 260℃/10 seconds at terminals. Additionally, it is compliant with RoHS 2002/95/1 and WEEE 2002/96/EC.

Specifications and features

- Low profile package
- Ideal for automated placement
- Ultrafast reverse recovery time
- Low power losses, high efficiency
- Low forward voltage drop
- High surge capability
- High temperature soldering: 260℃/10 seconds at terminals
- Component in accordance to RoHS 2002/95/1 and WEEE 2002/96/EC

Application Scenarios

The SS16L R3 IC chip can be used in a variety of electronic devices and applications. Its low profile package makes it suitable for devices with limited space. The ideal automated placement feature makes it easier for manufacturers to integrate into their production processes. The ultrafast reverse recovery time and low power losses contribute to improved efficiency in power systems. The high surge capability makes it suitable for applications where sudden power surges may occur.

Comparison

- Low profile package saves space
- Ideal for automated placement streamlines production
- Ultrafast reverse recovery time improves efficiency
- Low power losses reduce energy consumption
- Low forward voltage drop ensures better performance
- High surge capability for applications with power surges

- None identified