Description

The RFE191ES is a surface mount hexfet transistor in a leadless chip carrier (LCC-18) package. It is designed to be a close replacement for the TO-39 package, providing extra flexibility for increasing circuit board density. The LCC package has a larger bottom source pad, improving the thermal and electrical performance. Moreover, the lid of the package is grounded to the source, reducing RF interference.

Specifications and features

- Surface Mount

- Small Footprint

- Alternative to TO-39 Package

- Hermetically Sealed

- Dynamic dv/dt Rating

- Avalanche Energy Rating

- Simple Drive Requirements

- Light Weight

Application Scenarios

The RFE191ES is suitable for various applications, including power circuits, circuit board designs that require high density, and situations where RF interference needs to be minimized. It is widely used in the electronic industry.

Comparison

- Surface mount technology allows for easy installation and space-saving.

- The larger bottom source pad enhances thermal and electrical performance.

- The lid of the package is grounded to reduce RF interference.

- Hermetically sealed for protection against external elements.

- Dynamic dv/dt and Avalanche Energy ratings ensure reliable performance under changing conditions.

- Simple drive requirements make it easy to integrate into various circuit designs.

- Light weight for efficient transportation and handling.

- Some users may still prefer the traditional TO-39 package over the LCC package.