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S29GL01GS11TFI010 - Brand New SPANSION Memory - Datasheet - Chipdatas

S29GL01GS11TFI010 - Brand New SPANSION Memory

In Stock:2042 ,Ready for Immediate Shipping
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In Stock: 2042, Ready for Immediate Shipping
Brand:SPANSION
Category:Memory
Chipdatas Part No.:CD94-S29GL01GS11TFI010
Manufacturer Part No.:S29GL01GS11TFI010
Datecode:09+
Package:TSOP-56
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  • Description

    The S29GL01GS11TFI010 is a 1 Gbit (128 Mbyte) GL-S MirrorBit Eclipse Flash Non-Volatile Memory component. It belongs to the Memory product category. This electronic component is part of the Spansion S29GL series and is fabricated on 65 nm process technology. It offers fast page access and random access times, making it ideal for embedded applications that require higher density, better performance, and lower power consumption.

    Specifications and features

    - 1 Gbit (128 Mbyte) capacity
    - 65 nm MirrorBit Eclipse Technology
    - Single supply voltage (VCC) for read/program/erase (2.7V to 3.6V)
    - Versatile I/O Feature with wide I/O voltage range (VIO): 1.65V to VCC
    - x16 data bus
    - Asynchronous 32-byte Page read
    - 512-byte Programming Buffer for programming in page multiples
    - Sector Erase with uniform 128-kbyte sectors
    - Suspend and Resume commands for Program and Erase operations
    - Status Register, Data Polling, and Ready/Busy pin methods for device status
    - Advanced Sector Protection (ASP)
    - Separate 1024-byte One Time Program (OTP) array with two lockable regions
    - Common Flash Interface (CFI) parameter table
    - Temperature Range: Industrial (-40°C to +85°C), In-Cabin (-40°C to +105°C)
    - 100,000 erase cycles for any sector (typical)
    - 20-year data retention (typical)
    - Packaging Options: 56-pin TSOP, 64-ball LAA Fortified BGA (13 mm x 11 mm), 64-ball LAE Fortified BGA (9 mm x 9 mm), 56-ball VBU Fortified BGA (9 mm x 7 mm)

    Application Scenarios

    The S29GL01GS11TFI010 electronic component can be used in various applications, including but not limited to:

    • Embedded systems
    • Consumer electronics
    • Automotive electronics
    • Industrial equipment

    Comparison

    Advantages
    • High density
    • Fast page access time
    • Wide temperature range
    • Versatile I/O feature
    • Advanced sector protection
    • Long data retention
    Disadvantages
    • Requires programming algorithms for optimal performance
    • Limited packaging options compared to other memory components
  • Similar parts: 9920 , Click to view
    Attributes Value
    Category Memory
    Manufacturer SPANSION
    Product Category Memory ICs
    Series GL-S
    Packaging Tray
    Package-Case 56-TFSOP (0.724", 18.40mm Width)
    Operating-Temperature -40°C ~ 85°C (TA)
    Interface Parallel
    Voltage-Supply 2.7 V ~ 3.6 V
    Supplier-Device-Package 56-TSOP
    Memory Capacity 1G (64M x 16)
    Memory-Type FLASH - NOR
    Speed 110ns
    Format-Memory FLASH
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  • Shopping guide

    Warranty:
    • - 30-day money-back return policy,
    • - 90-day warranty against any manufacturing defects. View more
    Returning:
    Within 30 days from date of shipment. View more

    Delivery period:
    • - Will ship out in 2-3 days
    • - DHL Express: 3-7 business days
    • - DHL eCommerce: 12-22 business days
    • - FedEx International Priority: 3-7 business days
    • - EMS: 10-15 business days
    Shipping fee:
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    • - View in your order page
    Shipping option:
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    • - Inquiry, Add to inquiry sheet/Submit bom/inquire file/Send email us > Quote > Place order > Complete payment >Delivery.
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Contact us
Additional Information
  • Datasheet: Download S29GL01GS11TFI010
  • Chipdatas Part: CD94-S29GL01GS11TFI010
  • Warehouse: China, Hong Kong
  • Dispatch: Within 24 hours
  • Free Shipping: Yes
  • Prority Shipping: Yes, 3-5 days
  • Last Updated: 2024/06/13 01:20 +0800
Refund
    • Full Refund if you don't receive your order
    • Full or Partial Refund , If the item is not as described
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