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Description
This document contains the specifications for the Intel® Advanced+ Boot Block Flash Memory (C3) Stacked Chip Scale Package (SCSP) device. The C3 SCSP device combines flash memory and SRAM into a single package, providing secure low-voltage memory solutions for portable applications. It offers enhanced security, instant locking/unlocking of any flash block with zero-latency, a 128-bit protection register for unique device identification, and improved 12V production programming for increased factory throughput.
Specifications and features
- 32-Mbit flash + 8-Mbit SRAM
- 32-Mbit flash + 4-Mbit SRAM
- 16-Mbit flash + 4-Mbit SRAM
- 16-Mbit flash memory + 2-Mbit SRAM
- Flash Memory Plus SRAM reduces memory board space required, simplifying PCB design complexity.
- Smallest memory subsystem footprint with SCSP technology.
- Advanced SRAM technology with 70 ns access time and low power operation.
- Intel® Flash Data Integrator (FDI) software for real-time data storage and code execution in the same memory device.
- Advanced+ Boot Block Flash Memory with instant individual block locking, a 128-bit protection register, 12V production programming, and extended temperature range.
- Blocking architecture with block sizes for code and data storage, 4-Kword parameter blocks, and 64-Kbyte main blocks.
- Low power operation with automatic power saving mode, asynchronous read current of 9mA (Flash), and standby current of 7µA (Flash).
- Flash technologies include 0.25µm ETOX™ VI, 0.18µm ETOX™ VII, and 0.13µm ETOX™ VIII Flash technologies.
Application Scenarios
The Intel® Advanced+ Boot Block Flash Memory (C3) Stacked Chip Scale Package (SCSP) device is suitable for portable applications that require secure low-voltage memory solutions. Its small size, enhanced security features, and reliable performance make it ideal for use in smartphones, tablets, wearables, and other portable electronic devices.
Comparison
Advantages- Combines flash memory and SRAM into a single package, reducing memory board space required.
- Enhanced security with instant locking/unlocking of any flash block with zero-latency.
- 128-bit protection register enables unique device identification.
- Improved 12V production programming for increased factory throughput.
- Advanced SRAM technology with low power operation.
- Intel® Flash Data Integrator (FDI) software allows real-time data storage and code execution in the same memory device.
- Blocking architecture with different block sizes for code and data storage.
- Extended temperature range (-25 °C to +85 °C).
Disadvantages- None identified
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Datasheet
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Shopping guide
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- Last Updated: 2024/10/01 07:51 +0800
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