5177984-9 - Brand New TE Connectivity AMP Connectors Rectangular - Board to Board Connectors - Arrays, Edge Type, Mezzanine
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Description
Electronic Component Model:5177984-9 is a fine pitch SMT stacking connector designed for parallel board stacking applications in high density packaging. It offers a compact and space-saving solution compared to conventional connectors. The connectors are available in sizes ranging from 40 to 200 positions, with board stacking heights from 5 [.197] to 16 [.630] (in 1 [.039] increments). It features bellows type spring contacts that are resistant to scooping and stubbing during mating and unmating. The connectors also come with positioning bosses for proper on-board orientation and are available packaged on "tape-and-reel" for automatic placement according to EIA standards. This model is recognized under the Component Program of Underwriter Laboratories Inc., with File No. E28476.
Specifications and features
- Designed for parallel board stacking applications
- High density packaging on 0.8 [.031] centerline spacing
- Available sizes from 40 to 200 positions (in 20 position increments)
- Board stacking heights available from 5 [.197] to 16 [.630] (in 1 [.039] increments)
- Bellows type spring contacts resistant to scooping and stubbing during mating and unmating
- Positioning bosses for proper on-board orientation
- Packaged on "tape-and-reel" for automatic placement per EIA standards
- Recognized under the Component Program of Underwriter Laboratories Inc., File No. E28476
Application Scenarios
This model is suitable for various electronic devices and systems that require parallel board stacking and high density packaging. It can be used in applications such as computer motherboards, industrial control systems, telecommunications equipment, and more.
Comparison
Advantages- Compact and space-saving design
- Wide range of available sizes and board stacking heights
- Bellows type spring contacts for resistance to scooping and stubbing
- Proper on-board orientation with positioning bosses
- Packaged on "tape-and-reel" for automatic placement
- Recognized under the Component Program of Underwriter Laboratories Inc.
Disadvantages- Not suitable for applications that do not require parallel board stacking or high density packaging
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Similar parts: 1531 , Click to view
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Datasheet
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Shopping guide
Delivery period:
- - Will ship out in 2-3 days
- - DHL Express: 3-7 business days
- - DHL eCommerce: 12-22 business days
- - FedEx International Priority: 3-7 business days
- - EMS: 10-15 business days
Shipping fee:
- - Automatic Email notification (above 5 times)
- - View in your order page
Shipping option:
DHL, FedEx, EMS, SF Express, and Registered Air MailShipping tracking:
- - Automatic Email notification (above 5 times)
- - View in your order page
How to Buy:
- - In-stock, Add to cart > Check out > Submit order > Complete payment >Delivery.
- - Inquiry, Add to inquiry sheet/Submit bom/inquire file/Send email us > Quote > Place order > Complete payment >Delivery.
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Payment:
- - Paypal,Credit Card includes Visa, Master, American Express.
- - Wire transfer, include Local bank transfer.
- - Western Union.
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Popular parts of the same kind
- Datasheet: Download 5177984-9
- Chipdatas Part: CD92-5177984-9
- Warehouse: China, Hong Kong
- Dispatch: Within 24 hours
- Free Shipping: Yes
- Prority Shipping: Yes, 3-5 days
- Last Updated: 2024/10/01 15:29 +0800
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- Full Refund if you don't receive your order
- Full or Partial Refund , If the item is not as described
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The fee is charged according to the rule of PayPal.
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The fee is charged according to the rule of PayPal.
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Western Union charge US$0.00 banking fee.
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We recommend to use bank transfer for large orders to save on handling fees.
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