Description

Electronic Component Model:5177984-9 is a fine pitch SMT stacking connector designed for parallel board stacking applications in high density packaging. It offers a compact and space-saving solution compared to conventional connectors. The connectors are available in sizes ranging from 40 to 200 positions, with board stacking heights from 5 [.197] to 16 [.630] (in 1 [.039] increments). It features bellows type spring contacts that are resistant to scooping and stubbing during mating and unmating. The connectors also come with positioning bosses for proper on-board orientation and are available packaged on "tape-and-reel" for automatic placement according to EIA standards. This model is recognized under the Component Program of Underwriter Laboratories Inc., with File No. E28476.

Specifications and features

- Designed for parallel board stacking applications

- High density packaging on 0.8 [.031] centerline spacing

- Available sizes from 40 to 200 positions (in 20 position increments)

- Board stacking heights available from 5 [.197] to 16 [.630] (in 1 [.039] increments)

- Bellows type spring contacts resistant to scooping and stubbing during mating and unmating

- Positioning bosses for proper on-board orientation

- Packaged on "tape-and-reel" for automatic placement per EIA standards

- Recognized under the Component Program of Underwriter Laboratories Inc., File No. E28476

Application Scenarios

This model is suitable for various electronic devices and systems that require parallel board stacking and high density packaging. It can be used in applications such as computer motherboards, industrial control systems, telecommunications equipment, and more.

Comparison

- Compact and space-saving design

- Wide range of available sizes and board stacking heights

- Bellows type spring contacts for resistance to scooping and stubbing

- Proper on-board orientation with positioning bosses

- Packaged on "tape-and-reel" for automatic placement

- Recognized under the Component Program of Underwriter Laboratories Inc.

- Not suitable for applications that do not require parallel board stacking or high density packaging