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Description
This document contains the specifications for the Intel® Advanced+ Boot Block Flash Memory (C3) Stacked Chip Scale Package (SCSP) device. C3 SCSP memory solutions are offered in different combinations, including 32-Mbit flash + 8-Mbit SRAM, 32-Mbit flash + 4-Mbit SRAM, 16-Mbit flash + 4-Mbit SRAM, and 16-Mbit flash memory + 2-Mbit SRAM. The C3 SCSP device combines flash memory and SRAM into a single package, providing secure low-voltage memory solutions for portable applications. The flash memory offers enhanced security, instant locking/unlocking of any flash block with zero-latency, a 128-bit protection register for unique device identification, and improved 12 V production programming for increased factory throughput.
Specifications and features
- Flash Memory Plus SRAM: Reduces memory board space required and simplifies PCB design complexity
- SCSP Technology: Smallest memory subsystem footprint with various area options and heights
- Advanced SRAM Technology: 70 ns Access Time, low power operation, and low voltage data retention mode
- Intel® Flash Data Integrator (FDI) Software: Real-time data storage and code execution in the same memory device, with full flash file manager capability
- Advanced+ Boot Block Flash Memory: 70 ns Access Time, instant individual block locking, 128-bit protection register, 12 V production programming, fast program and erase suspend, and extended temperature range of -25 °C to +85 °C
- Blocking Architecture: Block sizes for code + data storage, 4-Kword parameter blocks, 64-Kbyte main blocks, and 100,000 erase cycles per block
- Low Power Operation: Asynchronous read current, standby current, and automatic power saving mode
- Flash Technologies: 0.25 µm ETOX™ VI, 0.18 µm ETOX™ VII, and 0.13 µm ETOX™ VIII Flash Technologies
Application Scenarios
The Intel® Advanced+ Boot Block Flash Memory (C3) Stacked Chip Scale Package (SCSP) device is designed for use in portable applications that require secure low-voltage memory solutions. It is suitable for a variety of electronic devices, including smartphones, tablets, and wearable devices.
Comparison
Advantages- Combines flash memory and SRAM into a single package
- Enhanced security with instant locking/unlocking of flash blocks
- Unique device identification with a 128-bit protection register
- Improved factory throughput with 12 V production programming
- Smallest memory subsystem footprint with SCSP technology
- Low power operation and low voltage data retention mode
- Real-time data storage and code execution with Intel® Flash Data Integrator (FDI) Software
- Various blocking architectures for code + data storage
- Extended temperature range for versatile usage
Disadvantages- No specific disadvantages identified
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Datasheet
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Shopping guide
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- Last Updated: 2024/10/01 20:53 +0800
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