PF38F3050M0Y3DEA - Brand New Micron Technology Inc. Memory
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Description
This document contains the specifications for the Intel® Advanced+ Boot Block Flash Memory (C3) Stacked Chip Scale Package (SCSP) device. C3 SCSP memory solutions are offered in different combinations, including 32-Mbit flash + 8-Mbit SRAM, 32-Mbit flash + 4-Mbit SRAM, 16-Mbit flash + 4-Mbit SRAM, and 16-Mbit flash memory + 2-Mbit SRAM.
The C3 SCSP device combines flash memory and SRAM into a single package, providing secure low-voltage memory solutions for portable applications. The flash memory offers enhanced security, instant locking/unlocking of any flash block with zero-latency, a 128-bit protection register for unique device identification, and improved 12 V production programming for increased factory throughput.
Specifications and features
- Flash Memory Plus SRAM reduces memory board space required and simplifies PCB design complexity.
- SCSP Technology offers the smallest memory subsystem footprint and includes different area sizes and heights for different combinations of flash and SRAM.
- The Advanced SRAM Technology provides low-power operation, low voltage data retention mode, and 70 ns access time.
- The Intel® Flash Data Integrator (FDI) Software enables real-time data storage and code execution in the same memory device, with full flash file manager capability.
- The Advanced+ Boot Block Flash Memory offers instant, individual block locking, a 128-bit protection register, 12 V production programming, fast program and erase suspend, and extended temperature range.
- The Blocking Architecture includes different block sizes for code and data storage, 4-Kword parameter blocks, 64-Kbyte main blocks, and support for up to 100,000 erase cycles per block.
- The device operates with low power consumption, including asynchronous read current of 9 mA (flash), standby current of 7 µA (flash), and automatic power saving mode.
- Flash technologies available include 0.25 µm ETOX™ VI, 0.18 µm ETOX™ VII, and 0.13 µm ETOX™ VIII.
Application Scenarios
The Intel® Advanced+ Boot Block Flash Memory (C3) Stacked Chip Scale Package (SCSP) device is suitable for various portable applications that require secure low-voltage memory solutions. It can be used in devices such as smartphones, tablets, portable media players, and other electronic devices with limited space for memory storage.
Comparison
Advantages- Combines flash memory and SRAM in a single package
- Enhanced security features
- Instant locking/unlocking with zero-latency
- 128-bit protection register for unique device identification
- Improved 12 V production programming for increased factory throughput
Disadvantages- Limited options for flash memory sizes
- Not suitable for applications requiring larger memory capacity
- May not be compatible with older device models
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Similar parts: 9920 , Click to view
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Datasheet
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Shopping guide
Delivery period:
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- Datasheet: Download PF38F3050M0Y3DEA
- Chipdatas Part: CD93-PF38F3050M0Y3DEA
- Warehouse: China, Hong Kong
- Dispatch: Within 24 hours
- Free Shipping: Yes
- Prority Shipping: Yes, 3-5 days
- Last Updated: 2024/06/03 11:11 +0800
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- Full Refund if you don't receive your order
- Full or Partial Refund , If the item is not as described
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