Description

Electronic Component Model: TX5S386-19

Product Category: IC Chips

Specifications and features

■ Access Times of 50*, 60, 70, 90, 120, 150ns

■ Packaging:

• 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400)
• 68 lead, Hermetic CQFP (G2U)1, 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510)
• 68 lead, Hermetic CQFP (G1U), 23.9mm (0.940 inch) square, 3.56mm (0.140 inch) high (Package 519)
• 68 lead, Hermetic CQFP (G1T), 23.9mm (0.940 inch) square, 4.06mm (0.160 inch) high (Package 524)

■ Sector Architecture

• 8 equal size sectors of 16KBytes each
• Any combination of sectors can be concurrently erased. Also supports full chip erase

■ 100,000 Erase/Program Cycles Typical, 0°C to +70°C

■ Organized as 128Kx32

■ Commercial, Industrial and Military Temperature Ranges

■ 5 Volt Programming. 5V ± 10% Supply

■ Low Power CMOS, 1mA Standby Typical

■ Embedded Erase and Program Algorithms

■ TTL Compatible Inputs and CMOS Outputs

■ Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation

■ Page Program Operation and Internal Program Control Time

■ Weight

• WF128K32-XG1UX5 - 5 grams typical
• WF128K32-XG1TX5 - 5 grams typical
• WF128K32-XG2UX51 - 8 grams typical
• WF128K32-XH1X5 - 13 grams typical

Application Scenarios

This electronic component model, TX5S386-19, is suitable for a variety of applications including but not limited to:

• Integrated circuits
• Electronics manufacturing
• Electronic devices

Comparison

- Access Times of 50ns to 150ns

- Organized as 128Kx32

- Supports concurrent sector erasure and chip erase

- 100,000 Erase/Program Cycles Typical, 0°C to +70°C

- Commercial, Industrial and Military Temperature Ranges

- Low Power CMOS

- Embedded Erase and Program Algorithms

- Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation

- Page Program Operation and Internal Program Control Time

- Different packaging options may require additional considerations for compatibility