Description

This electronic component model is called RKV501KJR1 and belongs to the product category of IC chips. It has distinctive characteristics that make it suitable for logic-level applications. The subminiature size of this component helps to save space on PC boards. It has a totally sealed body construction, which prevents contact contamination and allows for automated soldering and cleaning, saving both time and money. The RKV501KJR1 also features an award-winning STC contact mechanism that provides smoother, positive detent actuation, increased contact stability, and unparalleled logic-level reliability. The terminals of this component are molded-in, epoxy-sealed, or ultrasonically welded, effectively locking out flux, solvents, and other contaminants. It follows a standard PC board grid spacing of .100” x .100” (2.54mm x 2.54mm), and matching indicators are available for use.

Specifications and features

• Product Model: RKV501KJR1
• Product Category: IC Chips
• Size: Subminiature
• Terminal Spacing: .100” x .100” (2.54mm x 2.54mm)
• Sealed Body Construction: Yes
• Contact Mechanism: STC
• Terminals: Molded-in, Epoxy Sealed or Ultrasonically Welded

Application Scenarios

The RKV501KJR1 electronic component model is commonly used in logic-level applications on PC boards. It is particularly suitable for situations where space-saving is essential and where automated soldering and cleaning processes are employed. The sealed body construction ensures reliable contact performance and prevents contamination, making it ideal for various electronic devices and equipment.

Comparison

• Subminiature size saves space on PC boards
• Totally sealed body construction prevents contact contamination
• Award-winning STC contact mechanism provides smoother and more reliable operation
• Molded-in, epoxy-sealed or ultrasonically welded terminals lock out flux, solvents, and other contaminants

• None identified