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Description
This document contains the specifications for the Intel® Advanced+ Boot Block Flash Memory (C3) Stacked Chip Scale Package (SCSP) device. The C3 SCSP memory solutions are offered in various combinations, including 32-Mbit flash + 8-Mbit SRAM, 32-Mbit flash + 4-Mbit SRAM, 16-Mbit flash + 4-Mbit SRAM, and 16-Mbit flash memory + 2-Mbit SRAM. The C3 SCSP device combines flash memory and SRAM into a single package, providing secure low-voltage memory solutions for portable applications.
Specifications and features
The flash memory of the C3 SCSP device offers enhanced security, instant locking/unlocking of any flash block with zero latency, a 128-bit protection register for unique device identification, and improved 12 V production programming for increased factory throughput.
Application Scenarios
The C3 SCSP device is designed to reduce memory board space required, simplifying PCB design complexity. It features SCSP technology, which offers the smallest memory subsystem footprint and supports different flash and SRAM configurations. The device also includes advanced SRAM technology with low power operation and low voltage data retention mode. It is compatible with Intel® Flash Data Integrator (FDI) software and supports real-time data storage and code execution in the same memory device. The C3 SCSP device is suitable for applications that require a compact memory solution with advanced features.
Comparison
Advantages- Secure low-voltage memory solutions for portable applications
- Enhanced security with instant locking/unlocking of flash blocks
- Unique device identification with a 128-bit protection register
- Improved factory throughput with 12 V production programming
- Reduces memory board space and simplifies PCB design complexityDisadvantages- Requires separate SRAM memory
- Limited configurations available
- Limited compatibility with specific technologies -
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Datasheet
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- Last Updated: 2024/10/01 21:13 +0800
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