EPM7256AFC256-7 - Brand New Intel / Altera IC Chips
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Description
EPM7256AFC256-7 is an electronic component model that belongs to the IC Chips product category. It is a high-density, high-performance device based on Altera's second-generation MAX architecture. The device is a 3.3-V EEPROM-based programmable logic device (PLD) built on the second-generation Multiple Array MatriX (MAX®) architecture. It supports in-system programmability (ISP) through the built-in IEEE Std. 1149.1 Joint Test Action Group (JTAG) interface with advanced pin-locking capability. The device also features built-in boundary-scan test (BST) circuitry compliant with IEEE Std. 1149.1 and supports JEDEC Jam Standard Test and Programming Language (STAPL) JESD-71. With pin compatibility with the popular 5.0-V MAX 7000S devices and a high-density range of 600 to 10,000 usable gates, EPM7256AFC256-7 offers enhanced performance and flexibility for electronic designs. It is available in various package options, including thin quad flat pack (TQFP), plastic quad flat pack (PQFP), ball-grid array (BGA), space-saving FineLine BGA, and plastic J-lead chip carrier (PLCC) packages.
Specifications and features
- Based on Altera's second-generation MAX architecture
- High-density, high-performance 3.3-V EEPROM-based programmable logic device (PLD)
- Supports in-system programmability (ISP) through the built-in IEEE Std. 1149.1 JTAG interface with advanced pin-locking capability
- Built-in boundary-scan test (BST) circuitry compliant with IEEE Std. 1149.1
- Supports JEDEC Jam Standard Test and Programming Language (STAPL) JESD-71
- Pin-compatible with the popular 5.0-V MAX 7000S devices
- High-density PLDs ranging from 600 to 10,000 usable gates
- Extended temperature range
- Pin counts ranging from 44 to 256 in a variety of package options
- Supports hot-socketing in MAX 7000AE devices
- Programmable interconnect array (PIA) continuous routing structure
- PCI-compatible
- Bus-friendly architecture, including programmable slew-rate control
- Enhanced interconnect resources for improved routability
- Programmable output slew-rate control
- Programmable ground pins
Application Scenarios
- Electronic design projects requiring high-density, high-performance programmable logic
- Designs that require in-system programmability and advanced pin-locking capability
- Testing and programming electronic devices compliant with IEEE standards
- Projects requiring pin compatibility with 5.0-V MAX 7000S devices
- Applications where a high-density PLD with a wide temperature range is needed
- Projects with specific pin count and package requirements
Comparison
Advantages- High-density and high-performance design
- In-system programmability (ISP) with advanced pin-locking capability
- Built-in boundary-scan test (BST) circuitry compliant with IEEE Std. 1149.1
- Pin compatibility with 5.0-V MAX 7000S devices
- Extended temperature range
- Various package options for different project needs
Disadvantages- Limited compatibility with devices outside of MAX architecture
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Similar parts: 430483 , Click to view
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Datasheet
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Popular parts of the same kind
- Datasheet: Download EPM7256AFC256-7
- Chipdatas Part: CD94-EPM7256AFC256-7
- Warehouse: China, Hong Kong
- Dispatch: Within 24 hours
- Free Shipping: Yes
- Prority Shipping: Yes, 3-5 days
- Last Updated: 2024/06/13 16:44 +0800
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- Full Refund if you don't receive your order
- Full or Partial Refund , If the item is not as described
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