Warning: Undefined array key "twitterAccount" in /home/wwwroot/chipdatas.com/pc/config/main.php on line 278
BCM4331KML1G P21 - Brand New Broadcom IC Chips - Datasheet - Chipdatas

BCM4331KML1G P21 - Brand New Broadcom IC Chips

In Stock:77 ,Ready for Immediate Shipping
New RoSH Lead free
In Stock: 77, Ready for Immediate Shipping
Brand:Broadcom
Category:IC Chips
Chipdatas Part No.:CD86-BCM4331KML1G P21
Manufacturer Part No.:BCM4331KML1G P21
Datecode:09+
Package:QFN
Request Quote:
PCS
  • Description

    The Broadcom® BCM4330 single chip device provides for the highest level of integration for a mobile or handheld wireless system, with integrated IEEE 802.11™ a/b/g and single-stream 802.11n (MAC/baseband/radio), Bluetooth® 4.0 + HS, and FM radio receiver and transmitter. It includes on-chip 2.4 GHz and 5 GHz WLAN CMOS power amplifiers that meet the output power requirements of most handheld systems while permitting an optional external power amplifier for higher output power applications, if required.


    Specifications and features

    • Single-band 2.4 GHz 802.11 b/g/n or dual band 2.4 GHz and 5 GHz 802.11 a/b/g/n (non simultaneous)
    • Single stream 802.11n support for 20 MHz channels provides PHY layer rates up to MCS7 (72 Mbps) for typical upper-layer throughput in excess of 45 Mbps.
    • Integrated CMOS power amplifiers with internal power-detectors and closed-loop power control can deliver greater than 18 dBm of linear output power (in 2.4 GHz band).
    • PAs can be powered directly from VBAT, eliminating the need for a PALDO.
    • Up to 8 RF control signals are available to support optional external PAs for higher output power and LNAs for enhanced sensitivity.
    • Supports a single 2.4 GHz antenna shared between WLAN and Bluetooth.
    • Shared Bluetooth and WLAN receive signal path eliminates the need for an external power splitter while maintaining excellent sensitivity for both Bluetooth and WLAN.
    • Internal fractional nPLL allows support for a wide range of reference clock frequencies.
    • Supports IEEE 802.15.2 external three-wire coexistence scheme to optimize bandwidth utilization with other co-located wireless technologies such as GPS, WiMax, or UWB.
    • Supports standard SDIO v2.0 (50 MHz, 4-bit and 1-bit), and gSPI (48 MHz) host interfaces.
    • Alternative host interface supports HSIC (a USB 2.0 derivative for short-distance, on board connections).
    • Integrated ARM® Cortex-M3 processor and on-chip memory for complete WLAN subsystem functionality, minimizing the need to wake up the applications processor for standard WLAN functions. This allows for further minimization of power consumption, while maintaining the ability to field upgrade with future features.
    • OneDriver™ software architecture for easy migration from existing embedded WLAN and Bluetooth devices as well as future devices.
    • Bluetooth Core Specification Version 4.0 + HS compliant with provisions for supporting future specifications
    • Bluetooth Class 1 or Class 2 transmitter operation
    • Supports extended Synchronous Connections (eSCO), for enhanced voice quality by allowing for retransmission of dropped packets
    • Adaptive Frequency Hopping (AFH) for reducing radio frequency interference
    • Interface support—Host Controller Interface (HCI) using a high-speed UART interface and PCM for audio data
    • The FM unit supports HCI for communication, stereo analog input and output
    • Low-power consumption improves battery life of handheld devices
    • FM receiver: 65 MHz to 108 MHz FM bands; supports the European Radio Data Systems (RDS) and the North American Radio Broadcast Data System (RBDS) standards
    • Supports multiple simultaneous Advanced Audio Distribution Profiles (A2DP) for stereo sound
    • Automatic frequency detection for standard crystal and TCXO values
    • FM transmitter: 65 MHz to 108 MHz bands; supports both RDS and the RBDS standards and programmable output power.
    • Supports battery voltage range from 2.3V to 4.8V supplies with internal switching regulator
    • Programmable dynamic power management
    • 2 Kbit OTP for storing board parameters
    • Package options:
      - 144 ball FCFBGA (6.5 mm x 6.5 mm, 0.5 mm pitch)
      - 133 ball WLBGA (4.89 mm x 5.33 mm, 0.4 mm pitch)
      - 225 bump WLCSP (4.89 mm x 5.33 mm, 0.2 mm pitch)
    • Security:
      - WPA™- and WPA2™- (Personal) support for powerful encryption and authentication
      - AES and TKIP in hardware for faster data encryption and 802.11i compatibility
      - Reference WLAN subsystem provides Cisco® Compatible Extension- (CCX, CCX 2.0, CCX 3.0, CCX 4.0, CCX 5.0) certified
      - Reference WLAN subsystem provides Wi-Fi Protected Setup (WPS)
    • Worldwide regulatory support: Global products supported with worldwide homologated design

    Application Scenarios

    The BCM4330 single chip device can be used in various mobile or handheld wireless systems, such as smartphones, tablets, portable gaming devices, and wearable devices. It is suitable for applications that require integrated wireless connectivity, including Wi-Fi, Bluetooth, and FM radio.


    Comparison

    Advantages
    • High-level integration for mobile or handheld wireless systems
    • Supports single-band or dual-band Wi-Fi and Bluetooth
    • Integrated power amplifiers with closed-loop power control
    • External PA and LNA support for higher output power and enhanced sensitivity
    • Supports a wide range of reference clock frequencies
    • Low-power consumption for extended battery life
    • Integrated ARM Cortex-M3 processor for complete WLAN subsystem functionality
    • Bluetooth Core Specification Version 4.0 + HS compliant
    • Supports advanced audio distribution profiles for stereo sound
    • Provides security features for encryption and authentication
    • Worldwide regulatory support for global products
    Disadvantages
    • Requires optional external power amplifier for higher output power applications
    • Package options may limit board design flexibility

  • Similar parts: 430483 , Click to view
    Attributes Value
    Category IC Chips
    Manufacturer BROADCOM
    Product Category IC Chips
  • Latest 5 Reviews
    0 buyers commented on the product
  • Shopping guide

    Warranty:
    • - 30-day money-back return policy,
    • - 90-day warranty against any manufacturing defects. View more
    Returning:
    Within 30 days from date of shipment. View more

    Delivery period:
    • - Will ship out in 2-3 days
    • - DHL Express: 3-7 business days
    • - DHL eCommerce: 12-22 business days
    • - FedEx International Priority: 3-7 business days
    • - EMS: 10-15 business days
    Shipping fee:
    • - Automatic Email notification (above 5 times)
    • - View in your order page
    Shipping option:
    DHL, FedEx, EMS, SF Express, and Registered Air Mail
    Shipping tracking:
    • - Automatic Email notification (above 5 times)
    • - View in your order page
    View more

    How to Buy:
    • - In-stock, Add to cart > Check out > Submit order > Complete payment >Delivery.
    • - Inquiry, Add to inquiry sheet/Submit bom/inquire file/Send email us > Quote > Place order > Complete payment >Delivery.
    • View more
    Payment:
    • - Paypal,Credit Card includes Visa, Master, American Express.
    • - Wire transfer, include Local bank transfer.
    • - Western Union.
    • View more
Contact us
Additional Information
  • Datasheet: Download BCM4331KML1G P21
  • Chipdatas Part: CD86-BCM4331KML1G P21
  • Warehouse: China, Hong Kong
  • Dispatch: Within 24 hours
  • Free Shipping: Yes
  • Prority Shipping: Yes, 3-5 days
  • Last Updated: 2024/06/26 08:26 +0800
Refund
    • Full Refund if you don't receive your order
    • Full or Partial Refund , If the item is not as described
Related Products
  • E-STLC2500CTR - Brand New STMicroelectronics IC Chips
    WFBGA
  • CY7C68053A-56BA - Brand New Cypress Semiconductor IC Chips
    BGA
  • AR8035-AL1A-R - Brand New QCA IC Chips
    BGA
  • BL1117-ADC - Brand New Belling IC Chips
    SOT-223
  • HM628512BLFP-7 - Brand New Nexperia IC Chips
    SOP-32
  • BCM5325FKQMG - Brand New Broadcom IC Chips
    QFP
  • D431000AGW-70LL - Brand New NEC IC Chips
    SOP
  • HT46R003B - Brand New HOLTEK IC Chips
    SOP-16
  • BCM2045KWBG - Brand New Broadcom IC Chips
    BGA
  • H26M52103FMR - Brand New Skhynix IC Chips
    BGA
Payment Method
  • The fee is charged according to the rule of PayPal.
  • The fee is charged according to the rule of PayPal.
  • Western Union charge US$0.00 banking fee.
  • We recommend to use bank transfer for large orders to save on handling fees.
Shipping Tips
  • DHL(www.dhl.com)
    $40 limited time offer.
  • UPS(www.ups.com)
    $40 limited time offer.
  • FedEx(www.fedex.com)
    $40 limited time offer.
  • Registered Mail(www.singpost.com)
    Free shipping without minimum order.
The tension in logistics has eased and normal shipping has resumed. All orders shipments will be sent out within 1-2 days.
Upload

Uploaded file detected, select the action you want:

Upload file

Click Bom button for BOM cost budget、Compare price and stock、send RFQ or place order.
Send RFQ button will submit your document to us,and feedback to you within 24 hours.