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E2508AEBG-6E-E - Brand New ELPIDA IC Chips - Datasheet - Chipdatas

E2508AEBG-6E-E - Brand New ELPIDA IC Chips

In Stock:2081 ,Ready for Immediate Shipping
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In Stock: 2081, Ready for Immediate Shipping
Brand:ELPIDA
Category:IC Chips
Chipdatas Part No.:CD93-E2508AEBG-6E-E
Manufacturer Part No.:E2508AEBG-6E-E
Datecode:09+
Package:BGA
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  • Description and Applications

    The MA4E2508 SurMountä Anti-Parallel Diode Series are Silicon Low, Medium & High Barrier Schottky Devices fabricated with the patented Heterolithic Microwave Integrated Circuit (HMIC) process. HMIC circuits consist of Silicon pedestals which form diodes or via conductors embedded in a glass dielectric, which acts as the low dispersion, low loss, microstrip transmission medium. The combination of silicon and glass allows HMIC devices to have excellent loss and power dissipation characteristics in a low profile, reliable device.
    The Surmount Schottky devices are excellent
    choices for circuits requiring the small parasitics of a beam lead device coupled with the superior mechanical performance of a chip. The SurMount structure employs very low resistance silicon vias to connect the Schottky contacts to the metalized mounting pads on the bottom surface of the chip. These devices are reliable, repeatable, and a lower cost performance solution to conventional devices. They have lower susceptibility to electrostatic discharge than conventional beam lead Schottky diodes.
    The multi-layer metalization employed in the fabrication of the Surmount Schottky junctions includes a platinum diffusion barrier, which permits all devices to be subjected to a 16-hour non-operating stabilization bake at 300°C.
    The “ 0502 ” outline allows for Surface Mount placement and multi- functional polarity orientations.
    The MA4E2508 Family of SurMount Schottky diodes are recommended for use in microwave circuits through Ku band frequencies for lower power applications such as mixers, sub-harmonic mixers, detectors and limiters. The HMIC construction facilitates the direct replacement of more fragile beam lead diodes with the corresponding Surmount diode, which can be connected to a hard or soft substrate circuit with solder.

    Features

    ● Extremely Low Parasitic Capitance and Inductance
    ● Surface Mountable in Microwave Circuits, No Wirebonds Required
    ● Rugged HMIC Construction with Polyimide Scratch Protection
    ● Reliable, Multilayer Metalization with a Diffusion
    ● Barrier, 100% Stabilization Bake (300°C, 16 hours)
    ● Lower Susceptibility to ESD Damage

  • Similar parts: 430483 , Click to view
    Attributes Value
    Category IC Chips
    Manufacturer ELPIDA
    Product Category IC Chips
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    • - 90-day warranty against any manufacturing defects. View more
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Additional Information
  • Datasheet: Download E2508AEBG-6E-E
  • Chipdatas Part: CD93-E2508AEBG-6E-E
  • Warehouse: China, Hong Kong
  • Dispatch: Within 24 hours
  • Free Shipping: Yes
  • Prority Shipping: Yes, 3-5 days
  • Last Updated: 2024/06/03 11:58 +0800
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    • Full or Partial Refund , If the item is not as described
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