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Description
This document contains the specifications for the Intel® Advanced+ Boot Block Flash Memory (C3) Stacked Chip Scale Package (SCSP) device. C3 SCSP memory solutions are offered in various combinations of flash memory and SRAM. The C3 SCSP device combines flash memory and SRAM into a single package, providing secure low-voltage memory solutions for portable applications.
Specifications and features
The flash memory of this device offers enhanced security, instant locking/unlocking of any flash block with zero-latency, and a 128-bit protection register for unique device identification. It also features improved 12 V production programming for increased factory throughput. The device utilizes SCSP technology, which reduces memory board space required and simplifies PCB design complexity. The device is available in different sizes, such as 16 Mbit and 32 Mbit, with corresponding SRAM sizes. It also employs advanced SRAM technology, with low power operation and low voltage data retention mode. The Intel® Flash Data Integrator (FDI) Software allows real-time data storage and code execution in the same memory device, with full flash file manager capability. The device also utilizes Advanced+ Boot Block Flash Memory, with individual block locking, 128-bit protection register, and 12 V production programming. It has a blocking architecture with different block sizes for code and data storage. The device operates on low power and has automatic power saving mode. It utilizes various flash technologies, including 0.25 µm ETOX™ VI, 0.18 µm ETOX™ VII, and 0.13 µm ETOX™ VIII flash technologies.
Application Scenarios
This device is suitable for portable applications that require secure low-voltage memory solutions. It can be used in various electronic devices such as smartphones, tablets, and portable medical devices. The compact size and advanced technology make it ideal for devices with limited space.
Comparison
Advantages- Combines flash memory and SRAM in a single package, reducing memory board space and simplifying PCB design complexity
- Enhanced security features for protecting data
- Instant locking/unlocking of any flash block with zero-latency
- 128-bit protection register for unique device identification
- Improved 12 V production programming for increased factory throughput
- Utilizes SCSP technology for the smallest memory subsystem footprint
- Advanced SRAM technology with low power operation and low voltage data retention mode
- Intel® Flash Data Integrator (FDI) Software for real-time data storage and code execution
- Blocking architecture with different block sizes for code and data storage
- Low power operation with automatic power saving mode
Disadvantages- Limited options for flash and SRAM sizes
- Requires 12 V production programming
- Operational temperature range of -25 °C to +85 °C
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Datasheet
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- Last Updated: 2024/06/30 18:40 +0800
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