DMS3016SSSA-13-F - Brand New Diodes Incorporated IC Chips
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Description
Electronic Component Model: DMS3016SSSA-13-F
Product Category: IC Chips
Dual Cool™ packaging technology, provides both bottom- and top-side cooling in a PQFN package. Not only is the PQFN footprint an industry standard, it provides the designer with performance flexibility. With enhanced dual path thermal performance and improved parasitics over its wire-bonded predecessors, the use of a heat sink with Dual Cool packaging technology provides even more impressive results. Test results prove that, when a heat sink is used with our Dual Cool package technology, synchronous buck converters deliver higher output current and increased power density. With Fairchild’s trench silicon technology, Dual Cool packaging technology proves to be a clear leader in power density and thermal performance. Our Dual Cool package solutions are lead free and RoHS compliant and are available in 3.3 mm x 3.3 mm and 5 mm x 6 mm PQFN packages.
Specifications and features
• Top-side cooling, lower thermal resistance from junction to top
• Same land pattern as 5 mm x 6 mm and 3.3 mm x 3.3 mm PQFN – JEDEC standard
• Allows higher current and power dissipation
• Highest power density for DC-DC applications
• Use with or without a heat sink, reduces the number of qualified components in the BOM
• Multiple suppliers without cross licensing requirements
• High degree of production commonality with standard PQFN packaging
• 25 V - 150 V portfolio
Application Scenarios
• Point-of-load (POL) synchronous-buck conversion
• Servers
• Telecommunications, routing and switching
• Heat path from top only
Comparison
No specific comparison is mentioned in the provided information.
Advantages- Dual Cool packaging technology provides both bottom- and top-side cooling
- Enhanced dual path thermal performance and improved parasitics
- Higher output current and increased power density when used with a heat sink
- Lead-free and RoHS compliant
- Available in 3.3 mm x 3.3 mm and 5 mm x 6 mm PQFN packages
- High power density and thermal performance with Fairchild's trench silicon technology
DisadvantagesNo specific disadvantages are mentioned in the provided information.
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Similar parts: 430483 , Click to view
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Datasheet
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Shopping guide
Delivery period:
- - Will ship out in 2-3 days
- - DHL Express: 3-7 business days
- - DHL eCommerce: 12-22 business days
- - FedEx International Priority: 3-7 business days
- - EMS: 10-15 business days
Shipping fee:
- - Automatic Email notification (above 5 times)
- - View in your order page
Shipping option:
DHL, FedEx, EMS, SF Express, and Registered Air MailShipping tracking:
- - Automatic Email notification (above 5 times)
- - View in your order page
How to Buy:
- - In-stock, Add to cart > Check out > Submit order > Complete payment >Delivery.
- - Inquiry, Add to inquiry sheet/Submit bom/inquire file/Send email us > Quote > Place order > Complete payment >Delivery.
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Payment:
- - Paypal,Credit Card includes Visa, Master, American Express.
- - Wire transfer, include Local bank transfer.
- - Western Union.
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Popular parts of the same kind
- Datasheet: Download DMS3016SSSA-13-F
- Chipdatas Part: CD94-DMS3016SSSA-13-F
- Warehouse: China, Hong Kong
- Dispatch: Within 24 hours
- Free Shipping: Yes
- Prority Shipping: Yes, 3-5 days
- Last Updated: 2024/06/13 22:29 +0800
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- Full Refund if you don't receive your order
- Full or Partial Refund , If the item is not as described
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The fee is charged according to the rule of PayPal.
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The fee is charged according to the rule of PayPal.
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Western Union charge US$0.00 banking fee.
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We recommend to use bank transfer for large orders to save on handling fees.
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DHL(www.dhl.com)
$40 limited time offer. -
UPS(www.ups.com)
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FedEx(www.fedex.com)
$40 limited time offer. -
Registered Mail(www.singpost.com)
Free shipping without minimum order.
