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BGM200EG101 - Brand New NXP Semiconductors IC Chips - Datasheet - Chipdatas

BGM200EG101 - Brand New NXP Semiconductors IC Chips

In Stock:1010 ,Ready for Immediate Shipping
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In Stock: 1010, Ready for Immediate Shipping
Category:IC Chips
Chipdatas Part No.:CD94-BGM200EG101
Manufacturer Part No.:BGM200EG101
Datecode:09+
Package:SMD
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  • Description

    The BGM200EG101 is a type of IC chip used as an electronic component. It combines a low-insertion-loss pre-filter with Infineon's high-performance low-noise amplifier (LNA) for Global Positioning System (GPS) and Globalnaya Navigatsionnaya Sputnikovaya Sistema (GLONASS) applications. This component is designed to enhance the performance of GPS and GLONASS systems by reducing insertion loss and minimizing noise.

    Specifications and Features

    Main features of the BGM200EG101 include:

    • Operating frequencies: 1575.42 MHz and 1598.06-1605.38 MHz
    • High Gain: 14.8 dB
    • Low Noise Figure (GPS): 1.65 dB
    • Low current consumption: 4.0 mA
    • Out-of-band rejection in cellular bands: > 43 dBc
    • Input compression point in cellular bands: 30 dBm
    • Supply voltage: 1.5 V to 3.6 V
    • Tiny TSNP-7-10 leadless package (2.3 x 1.7 x 0.73 mm3)
    • RF output internally matched to 50 Ω
    • IEC ESD contact discharge of RF input pin: 6 kV
    • RoHS compliant package (Pb-free)

    Application Scenarios

    This electronic component can be used in various GPS and GLONASS applications where low insertion loss, high gain, low noise figure, and out-of-band rejection are crucial. It is suitable for a wide range of devices and systems that require precise positioning and navigation capabilities.

    Comparison

    Advantages

    The BGM200EG101 offers the following advantages:

    • High gain of 14.8 dB ensures strong and reliable signal amplification.
    • Low noise figure of 1.65 dB contributes to improved signal quality and accuracy.
    • Low current consumption of 4.0 mA helps to conserve power.
    • Out-of-band rejection of > 43 dBc minimizes interference from cellular bands.
    • Tiny TSNP-7-10 leadless package allows for compact and space-saving designs.
    • RF output internally matched to 50 Ω simplifies circuit integration.
    Disadvantages

    Currently, there are no known disadvantages or limitations associated with the BGM200EG101 electronic component model.

  • Similar parts: 430483 , Click to view
    Attributes Value
    Category IC Chips
    Manufacturer NXP Semiconductors
    Product Category IC Chips
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  • Shopping guide

    Warranty:
    • - 30-day money-back return policy,
    • - 90-day warranty against any manufacturing defects. View more
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Additional Information
  • Datasheet: Download BGM200EG101
  • Chipdatas Part: CD94-BGM200EG101
  • Warehouse: China, Hong Kong
  • Dispatch: Within 24 hours
  • Free Shipping: Yes
  • Prority Shipping: Yes, 3-5 days
  • Last Updated: 2024/06/03 11:45 +0800
Refund
    • Full Refund if you don't receive your order
    • Full or Partial Refund , If the item is not as described
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