Description

This is an electronic component model CYUO1M16SFEU-70BVXI that is categorized under IC chips. It is designed to help provide a solution to various electronic devices that require seamless connectivity, low power consumption, and high-performance human interface devices. This component has various functionalities that make it suitable for the development of digital video camcorders, printers, scanners, test and measurement equipment, personal navigation devices, medical imaging devices, video IP phones, portable media players, industrial cameras, data loggers, and data acquisition devices, among others.

Specifications and features

• Universal Serial Bus (USB) integration
• • USB 3.1, Gen 1 and USB 2.0 peripherals compliant with USB 3.1 Specification Revision 1.0 (TID # 340800007)
  • 5-Gbps SuperSpeed PHY compliant with USB 3.1 Gen 1
  • High-speed On-The-Go (HS-OTG) host and peripheral compliant with OTG Supplement Version 2.0
  • Thirty-two physical endpoints
  • Support for battery charging Specification 1.1 and accessory charger adaptor (ACA) detection.
• General Programmable Interface (GPIF™ II)
• Programmable 100-MHz GPIF II enables connectivity to a wide range of external devices
• 8-, 16-, 24-, and 32-bit data bus
• Up to16 configurable control signals
• Fully accessible 32-bit CPU
• ARM926EJ core with 200-MHz operation
• 512-KB or 256-KB embedded SRAM
• Additional connectivity to the following peripherals
• SPI master at up to 33 MHz
• UART support of up to 4 Mbps
• I2C master controller at 1 MHz
• I2S master (transmitter only) at sampling frequencies of 32 kHz, 44.1 kHz, and 48 kHz
• Selectable clock input frequencies
• 19.2, 26, 38.4, and 52 MHz
• 19.2-MHz crystal input support
• Ultra low-power in core power-down mode
• Less than 60 µA with VBATT on and 20 µA with VBATT off
• Independent power domains for core and I/O
• Core operation at 1.2 V
• I2S, UART, and SPI operation at 1.8 to 3.3 V
• I2C operation at 1.2 V to 3.3 V
• Package options
• 121-ball, 10- × 10-mm, 0.8-mm pitch Pb-free ball grid array (BGA)
• 131-ball, 4.7- × 5.1-mm, 0.4-mm pitch wafer-level chip scale package (WLCSP)
• EZ-USB® Software Development Kit (SDK) for code development of firmware and PC Applications
• Includes RTOS Framework (using ThreadX Version 5)
• Firmware examples covering all I/O modules
• Visual Studio host examples using C++ and C#
• SuperSpeed Explorer Board available for rapid prototyping
• Several accessory boards also available:
• • Adapter boards for Xilinx/Altera FPGA development
• • Adapter board for Video development
• • CPLD board for concept testing and initial development

Application Scenarios

The CYUO1M16SFEU-70BVXI IC chip is suitable for use in various electronic devices that require seamless connectivity, low power consumption, and high-performance human interface devices. Some of the applications include digital video camcorders, printers, scanners, test and measurement equipment, personal navigation devices, medical imaging devices, video IP phones, portable media players, industrial cameras, data loggers, data acquisition, and high-performance human interface devices (gesture recognition) among others.

Comparison

• Provides seamless connectivity
• low power consumption
• High-performance human interface devices.
• Has a Universal Serial Bus (USB) integration
• Has additional connectivity to various peripherals such as SPI master, UART support, I2C master controller, and I2S master for audio transmissions.
• Includes EZ-USB® Software Development Kit (SDK) for code development of firmware and PC Applications
• SuperSpeed Explorer Board available for rapid prototyping

• This IC chip is designed to work with specific devices, which limits its general application in all electronic devices.
• It may be relatively expensive than some of the similar IC chips available in the market.