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Description
The µPC2757TB and µPC2758TB are silicon monolithic integrated circuits designed as 1st frequency down converters for cellular/cordless telephone receiver stages. These ICs consist of a mixer and a local amplifier. The µPC2757TB features low current consumption while the µPC2758TB features improved intermodulation. You can choose either IC based on your system design. The TB suffix ICs are smaller in package size compared to the conventional T suffix ICs, making them ideal for reducing system size. Manufactured using NEC's 20 GHz fT NESAT™||| silicon bipolar process, these ICs have excellent performance, uniformity, and reliability, thanks to the use of silicon nitride passivation film and gold electrodes that protect the chip surface from external pollution and prevent corrosion/migration.
Specifications and features
- Wideband operation: fRFin = 0.1 to 2.0 GHz, fIFin = 20 to 300 MHz
- High-density surface mounting: 6-pin super minimold package
- Low current consumption: ICC = 5.6 mA TYP. @ µPC2757TB, ICC = 11 mA TYP. @ µPC2758TB
- Supply voltage: VCC = 2.7 to 3.3 V
- Minimized carrier leakage: Due to double balanced mixer
- Equable output impedance: Single-end push-pull IF amplifier
- Built-in power save function
Application Scenarios
- Cellular/cordless telephone up to 2.0 GHz MAX. (example: GSM, PDC800M, PDC1.5G, and so on): µPC2758TB
- Cellular/cordless telephone up to 2.0 GHz MAX. (example: CT1, CT2, and so on): µPC2757TB
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Datasheet
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Shopping guide
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Popular parts of the same kind
- Datasheet: Download UPC2757TB-E3
- Chipdatas Part: CD91-UPC2757TB-E3
- Warehouse: China, Hong Kong
- Dispatch: Within 24 hours
- Free Shipping: Yes
- Prority Shipping: Yes, 3-5 days
- Last Updated: 2024/06/12 09:13 +0800
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