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LSM330DLC - Brand New STMicroelectronics IC Chips - Datasheet - Chipdatas

LSM330DLC - Brand New STMicroelectronics IC Chips

In Stock:31 ,Ready for Immediate Shipping
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In Stock: 31, Ready for Immediate Shipping
Category:IC Chips
Chipdatas Part No.:CD93-LSM330DLC
Manufacturer Part No.:LSM330DLC
Datecode:09+
Package:LGA28
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  • Description

    The LSM330DLC is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope. ST's family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using a CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the sensing element characteristics. The LSM330DLC has a dynamically user selectable full-scale acceleration range of ±2 g/±4 g/±8 g/±16 g and angular rate of ±250/±500/±2000 deg/sec. The accelerometer and gyroscope sensors can be either activated or separately put in Low power/Power-down mode for applications optimized for power saving. The LSM330DLC is available in a plastic land grid array (LGA) package.

    Specifications and features

    ■ Analog supply voltage: 2.4 V to 3.6 V
    ■ Digital supply voltage IOs: 1.8 V
    ■ Low power mode
    ■ Power-down mode
    ■ 3 independent acceleration channels and 3 angular rate channels
    ■ ±2 g/±4 g/±8 g/±16 g dynamically selectable full scale
    ■ ±250/±500/±2000 dps dynamically selectable full scale
    ■ SPI/I2C serial interface (16-bit data output)
    ■ Programmable interrupt generator for free-fall and motion detection
    ■ ECOPACK® RoHS and "Green" compliant

    Application Scenarios

    ■ GPS navigation systems
    ■ Impact recognition and logging
    ■ Gaming and virtual reality input devices
    ■ Motion activated functions
    ■ Intelligent power saving for handheld devices
    ■ Vibration monitoring and compensation
    ■ Free-fall detection
    ■ 6D orientation detection

  • Similar parts: 430483 , Click to view
    Attributes Value
    Category IC Chips
    Manufacturer STMicroelectronics
    Product Category IC Chips
    Series iNEMO
    Packaging Tray
    Operating-Temperature -40°C ~ 85°C (TA)
    Output-Type I²C SPI
    Sensitivity 1 mg/digit 2 mg/digit 4 mg/digit 12 mg/digit
    Resolution 12 bit
    Sensor-Type Accelerometer Magnetometer 6 Axis
    Maximum Operating Temperature + 85 C
    Operating temperature range - 40 C
    Interface-Type I2C SPI
    Sensing-Axis X Y Z
    Acceleration 2 g 4 g 8 g 16 g
    Supply-Voltage-Max 3.6 VDC
    Supply-Voltage-Min 2.4 VDC
    Package-Case 28-TFLGA Module
    Mfr STMicroelectronics
    Package Tray
    Product-Status Obsolete
    Supplier-Device-Package 28-LGA (4x5)
    Mounting-Type Surface Mount
    Base-Product-Number LSM330
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  • Shopping guide

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    • - 90-day warranty against any manufacturing defects. View more
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Additional Information
  • Datasheet: Download LSM330DLC
  • Chipdatas Part: CD93-LSM330DLC
  • Warehouse: China, Hong Kong
  • Dispatch: Within 24 hours
  • Free Shipping: Yes
  • Prority Shipping: Yes, 3-5 days
  • Last Updated: 2024/06/13 08:26 +0800
Refund
    • Full Refund if you don't receive your order
    • Full or Partial Refund , If the item is not as described
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