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Description
This document contains the specifications for the Intel® Advanced+ Boot Block Flash Memory (C3) Stacked Chip Scale Package (SCSP) device. C3 SCSP memory solutions are offered in different combinations of flash memory and SRAM, providing secure low-voltage memory solutions for portable applications. The flash memory offers enhanced security, instant locking/unlocking of any flash block with zero-latency, a 128-bit protection register for unique device identification, and improved 12V production programming for increased factory throughput.
Specifications and features
- Flash Memory Plus SRAM: Reduces Memory Board Space Required, Simplifying PCB Design Complexity
- SCSP Technology: Smallest Memory Subsystem Footprint, Advanced SRAM Technology with 70 ns Access Time, Low Power Operation, and Low Voltage Data Retention Mode
- Intel® Flash Data Integrator (FDI) Software: Real-Time Data Storage and Code Execution in the Same Memory Device, Full Flash File Manager Capability
- Advanced+ Boot Block Flash Memory: 70 ns Access Time, Instant, Individual Block Locking, 128-bit Protection Register, 12 V Production Programming, Fast Program and Erase Suspend, Extended Temperature Range
- Blocking Architecture: Block Sizes for Code + Data Storage, 4-Kword Parameter Blocks, 64-Kbyte Main Blocks, 100,000 Erase Cycles per Block
- Low Power Operation: Asynchronous Read Current: 9 mA (Flash), Standby Current: 7 µA (Flash), Automatic Power Saving Mode
- Flash Technologies: 0.25 µm ETOX™ VI, 0.18 µm ETOX™ VII, and 0.13 µm ETOX™ VIII Flash TechnologiesApplication Scenarios
This device is suitable for portable applications that require secure low-voltage memory solutions. It can be used in various electronic devices such as mobile phones, tablets, and portable gaming consoles.
Comparison
Advantages- Provides enhanced security features for data protection
- Instant locking/unlocking of any flash block with zero-latency
- Unique device identification with a 128-bit protection register
- Improved 12V production programming for increased factory throughput
- Smallest memory subsystem footprint with SCSP technology
- Low power operation and low voltage data retention mode
- Real-time data storage and code execution in the same memory device with Intel® Flash Data Integrator (FDI) Software
- Fast program and erase suspend for efficient operation
- Extended temperature range for reliable performance
- Supports blocking architecture for code and data storage
- High erase cycles per block for longevity
- Automatic power saving mode for energy efficiency
- Utilizes advanced flash technologies for optimal performanceDisadvantages- Limited options for different combinations of flash memory and SRAM
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Datasheet
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Shopping guide
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- Last Updated: 2024/06/13 16:46 +0800
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