LCMXO2280C-3FTN324CCU1 - Brand New LATTICE IC Chips
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Description
The LCMXO2280C-3FTN324CCU1 is an electronic component model optimized for applications traditionally addressed by CPLDs and low capacity FPGAs. It is designed to fulfill the requirements of glue logic, bus bridging, bus interfacing, power-up control, and control logic. This device combines the best features of CPLD and FPGA devices in a single chip.
Specifications and Features
- Non-volatile, Infinitely Reconfigurable
- Instant-on - powers up in microseconds
- Single chip, no external configuration memory required
- Excellent design security, no bit stream to intercept
- Reconfigure SRAM based logic in milliseconds
- SRAM and non-volatile memory programmable through JTAG port
- Supports background programming of non-volatile memory
- Sleep Mode allows up to 100x static current reduction
- TransFR™ Reconfiguration (TFR) enables in-field logic updates while the system operates
- High I/O to Logic Density with 256 to 2280 LUT4s and 73 to 271 I/Os with extensive package options
- Density migration supported, lead free/RoHS compliant packaging
- Embedded and Distributed Memory with up to 27.6 Kbits sysMEM™ Embedded Block RAM and up to 7.5 Kbits distributed RAM, along with dedicated FIFO control logic
- Flexible I/O Buffer with programmable sysIO™ buffer supporting a wide range of interfaces such as LVCMOS, LVTTL, PCI, LVDS, Bus-LVDS, LVPECL, and RSDS
- sysCLOCK™ PLLs offering up to two analog PLLs per device for clock multiply, divide, and phase shifting
- System Level Support including IEEE Standard 1149.1 Boundary Scan, onboard oscillator, and compatibility with 3.3V, 2.5V, 1.8V, or 1.2V power supply
- IEEE 1532 compliant in-system programmingApplication Scenarios
The LCMXO2280C-3FTN324CCU1 can be used in various electronic applications such as:
- Glue logic circuits
- Bus bridging and interfacing
- Power-up control circuits
- Control logic circuits
- Systems requiring quick power-up times
- Applications requiring in-field logic updates
- Systems with high I/O to logic density requirements
- Embedded systems requiring SRAM and non-volatile memory programmability
- Systems with flexible I/O interface requirements
- Applications requiring system level support and compatibility with various power supply voltages
- Electronic devices that need to meet the RoHS compliance
Comparison
Advantages- Non-volatile and infinitely reconfigurable, allowing for flexibility in design
- Instant-on feature provides quick power-up times
- Single chip design eliminates the need for external configuration memory
- Excellent design security with no interceptable bitstream
- High I/O to Logic Density with a wide range of LUT4s and I/O options
- Embedded and distributed memory for efficient data storage
- Flexible I/O buffer supports multiple interfaces
- Clock PLLs offer precise clock control
- IEEE standard compatibility and in-system programming support for easy integration
- RoHS compliant packaging ensures environmental friendlinessDisadvantages- Limited LUT4s and I/O options compared to higher capacity FPGAs
- May not be suitable for applications requiring extremely large scale logic circuitry -
Similar parts: 430483 , Click to view
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Datasheet
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Shopping guide
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- Datasheet: Download LCMXO2280C-3FTN324CCU1
- Chipdatas Part: CD87-LCMXO2280C-3FTN324CCU1
- Warehouse: China, Hong Kong
- Dispatch: Within 24 hours
- Free Shipping: Yes
- Prority Shipping: Yes, 3-5 days
- Last Updated: 2024/06/25 14:38 +0800
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- Full Refund if you don't receive your order
- Full or Partial Refund , If the item is not as described
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