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RD38F2040W0YBQ0 - Brand New Intel IC Chips - Datasheet - Chipdatas

RD38F2040W0YBQ0 - Brand New Intel IC Chips

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In Stock: 74, Ready for Immediate Shipping
Brand:Intel
Category:IC Chips
Chipdatas Part No.:CD87-RD38F2040W0YBQ0
Manufacturer Part No.:RD38F2040W0YBQ0
Datecode:09+
Package:BGA
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  • Description

    The RD38F2040W0YBQ0 is an Intel® Advanced+ Boot Block Flash Memory (C3) Stacked Chip Scale Package (SCSP) device that combines flash memory and SRAM into a single package. It provides secure low-voltage memory solutions primarily for portable applications.

    Specifications and features

    • Flash Memory Plus SRAM which reduces memory board space required, simplifying PCB design complexity.
    • Smallest memory subsystem footprint using SCSP technology.
    • Advanced SRAM Technology with 70 ns access time, low-power operation, and low-voltage data retention mode.
    • Intel® Flash Data Integrator (FDI) Software for real-time data storage and code execution in the same memory device, full Flash File Manager capability.
    • Advanced+ Boot Block Flash Memory with 70 ns access time, instant individual block locking, 128-bit protection register, 12 V production programming, fast program and erase suspend, and extended temperature (-25°C to +85°C).
    • Blocking Architecture that offers block sizes for code + data storage, 4-Kword parameter blocks, 64-Kbyte Main Blocks, and 100,000 erase cycles per block.
    • Low Power Operation with asynchronous read current of 9 mA (Flash), standby current of 7 µA (Flash), and automatic power-saving mode.
    • Flash Technologies including 0.25 µm ETOX™ VI, 0.18 µm ETOX™ VII, and 0.13 µm ETOX™ VIII Flash technologies.

    Application Scenarios

    The RD38F2040W0YBQ0 is primarily used in portable applications that require secure low-voltage memory solutions. It is suited for small form factors, such as smartphones, tablets, and other mobile devices.

    Comparison

    Advantages
    • Combines flash memory and SRAM into a single package, reducing memory board space required and simplifying PCB design complexity.
    • Offers an instant locking/unlocking of any flash block with zero-latency, and a 128-bit protection register that enables unique device identification to meet the needs of next-generation portable applications.
    • Has a blocking architecture that offers block sizes for code + data storage, and 100,000 erase cycles per block.
    • Uses low-power operation with an asynchronous read current of 9 mA (Flash), standby current of 7 µA (Flash), and automatic power-saving mode.
    • Includes Flash Technologies such as 0.25 µm ETOX™ VI, 0.18 µm ETOX™ VII, and 0.13 µm ETOX™ VIII Flash technologies.
    Disadvantages
    • The device may not work with applications that require large amounts of memory storage.
    • The RD38F2040W0YBQ0 has a limited temperature range of -25°C to +85°C.
  • Similar parts: 430483 , Click to view
    Attributes Value
    Category IC Chips
    Manufacturer INTEL
    Product Category IC Chips
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  • Shopping guide

    Warranty:
    • - 30-day money-back return policy,
    • - 90-day warranty against any manufacturing defects. View more
    Returning:
    Within 30 days from date of shipment. View more

    Delivery period:
    • - Will ship out in 2-3 days
    • - DHL Express: 3-7 business days
    • - DHL eCommerce: 12-22 business days
    • - FedEx International Priority: 3-7 business days
    • - EMS: 10-15 business days
    Shipping fee:
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    • - Inquiry, Add to inquiry sheet/Submit bom/inquire file/Send email us > Quote > Place order > Complete payment >Delivery.
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Additional Information
  • Datasheet: Download RD38F2040W0YBQ0
  • Chipdatas Part: CD87-RD38F2040W0YBQ0
  • Warehouse: China, Hong Kong
  • Dispatch: Within 24 hours
  • Free Shipping: Yes
  • Prority Shipping: Yes, 3-5 days
  • Last Updated: 2024/07/01 12:56 +0800
Refund
    • Full Refund if you don't receive your order
    • Full or Partial Refund , If the item is not as described
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