S70FL256POXBHI210 - Brand New SPANSION IC Chips
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Description
This document contains information for the S70FL256P device, which is a dual die stack of two S25FL129P die. The device operates on a single power supply with a voltage range of 2.7 to 3.6V for read and write operations. It has a memory architecture consisting of uniform 64 kB sectors and 256-byte page size. The device supports page program, accelerated programming mode, quad page programming, bulk erase, sector erase, and sub-sector erase commands. It has a cycling endurance of 100,000 cycles per sector and a data retention of 20 years. The device also features a JEDEC standard two-byte electronic signature for identification, a one-time programmable (OTP) area for secure identification, and is CFI compliant. It is manufactured on 0.09 µm MirrorBit® process technology and is available in a 16-pin SO package or a 24-ball BGA package.
Specifications and features
- Dual die stack of two S25FL129P die - Single power supply operation: 2.7 to 3.6V read and write operations - Memory architecture: uniform 64 kB sectors, 256-byte page size - Program: page program (up to 256 bytes) in 1.5 ms, accelerated programming mode, quad page programming - Erase: bulk erase function, sector erase command (D8h) for 64 kB and 256 kB sectors, sub-sector erase command (P4E) for 4 kB sectors (for uniform 64-kB sector device only), sub-sector erase command (P8E) for 8 kB sectors (for uniform 64-kB sector device only) - Cycling endurance: 100,000 cycles per sector - Data retention: 20 years - Device ID: JEDEC standard two-byte electronic signature, RES command one-byte electronic signature for backward compatibility - One-time programmable (OTP) area for secure identification - CFI compliant - Manufactured on 0.09 µm MirrorBit® process technology - Package options: 16-pin SO package (300 mils), 24-ball BGA (6 x 8 mm) package (5 x 5 pin configuration)
Application Scenarios
This device is suitable for various applications that require a reliable and high-capacity flash memory solution. It can be used in consumer electronics, automotive systems, industrial equipment, and more. The device's uniform sector architecture, fast programming speed, and secure identification features make it well-suited for a wide range of applications.
Comparison
Advantages- Single power supply operation for convenience and simplicity. - Uniform sector architecture allows for easy organization of data. - Fast programming speed improves efficiency. - Secure identification feature enhances data security. - CFI compliance allows for compatibility with multiple flash devices.
Disadvantages- Limited cycling endurance compared to some other flash memory devices. - 16-pin SO package may have size limitations for some applications.
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Similar parts: 430483 , Click to view
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Datasheet
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Shopping guide
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Popular parts of the same kind
- Datasheet: Download S70FL256POXBHI210
- Chipdatas Part: CD93-S70FL256POXBHI210
- Warehouse: China, Hong Kong
- Dispatch: Within 24 hours
- Free Shipping: Yes
- Prority Shipping: Yes, 3-5 days
- Last Updated: 2024/06/03 11:54 +0800
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- Full Refund if you don't receive your order
- Full or Partial Refund , If the item is not as described
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