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Description
This document contains the specifications for the Intel® Advanced+ Boot Block Flash Memory (C3) Stacked Chip Scale Package (SCSP) device. C3 SCSP memory solutions are offered in the following combinations:
• 32-Mbit flash + 8-Mbit SRAM
• 32-Mbit flash + 4-Mbit SRAM
• 16-Mbit flash + 4-Mbit SRAM
• 16-Mbit flash memory + 2-Mbit SRAMThe C3 SCSP device combines flash memory and SRAM into a single package, which provides secure low-voltage memory solutions for portable applications.
The flash memory provides the following features:
• Enhanced security.
• Instant locking/unlocking of any flash block with zero-latency
• A 128-bit protection register that enables unique device identification, to meet the needs of next generation portable applications.
• Improved 12 V production programming for increased factory throughput.Specifications and features
- Flash Memory Plus SRAM
- SCSP Technology
- Advanced SRAM Technology
- Intel® Flash Data Integrator (FDI) Software
- Advanced+ Boot Block Flash Memory
- Blocking Architecture
- Low Power Operation
- Flash Technologies
Application Scenarios
This electronic component model can be used in various portable applications to provide secure and low-voltage memory solutions.
Comparison
Advantages:- Enhanced security
- Instant locking/unlocking of any flash block with zero-latency
- 128-bit protection register for unique device identification
- Improved 12 V production programming for increased factory throughput
- Small memory subsystem footprint
Disadvantages:- None specified
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Similar parts: 430483 , Click to view
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Datasheet
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Shopping guide
Delivery period:
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- Warehouse: China, Hong Kong
- Dispatch: Within 24 hours
- Free Shipping: Yes
- Prority Shipping: Yes, 3-5 days
- Last Updated: 2024/06/12 21:01 +0800
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- Full Refund if you don't receive your order
- Full or Partial Refund , If the item is not as described
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