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TE28F160C3TA90 - Brand New Intel IC Chips - Datasheet - Chipdatas

TE28F160C3TA90 - Brand New Intel IC Chips

In Stock:2068 ,Ready for Immediate Shipping
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In Stock: 2068, Ready for Immediate Shipping
Brand:Intel
Category:IC Chips
Chipdatas Part No.:CD94-TE28F160C3TA90
Manufacturer Part No.:TE28F160C3TA90
Datecode:09+
Package:TSSOP
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  • Description

    This section provides an overview of the TE28F160C3TA90, an Intel® Advanced+ Boot Block Flash Memory (C3) device with high-performance asynchronous reads and package-compatible densities. The device features individually-erasable memory blocks optimized for code and data storage, with parameter blocks located in the boot block and main blocks in the memory array.

    Specifications and features

    The TE28F160C3TA90 has the following specifications and features:

    • Flexible SmartVoltage Technology with 2.7 V–3.6 V Read/Program/Erase and 12 V for Fast Production Programming
    • 1.65 V–2.5 V or 2.7 V–3.6 V I/O Option, reducing overall system power
    • High Performance with 2.7 V–3.6 V: 70 ns Max Access Time
    • Optimized Architecture for Code Plus Data Storage, including eight 4 Kword Blocks and up to 127 32 Kword Blocks
    • Flexible Block Locking, allowing lock/unlock of any block with full protection on power-up and hardware block protection with WP# pin
    • Low Power Consumption with 9 mA Typical Read and 7 A Typical Standby with Automatic Power Savings Feature (APS)
    • Extended Temperature Operation from -40 °C to +85 °C
    • 128-bit Protection Register with a 64-bit Unique Device Identifier and 64-bit User Programmable OTP Cells
    • Extended Cycling Capability with a minimum of 100,000 Block Erase Cycles
    • Software support including Intel® Flash Data Integrator (FDI), Top or Bottom Boot Storage, Streaming Data support, Intel Basic Command Set, and Common Flash Interface (CFI)
    • Standard Surface Mount Packaging options including 48-Ball µBGA*/VFBGA, 64-Ball Easy BGA Packages, and 48-Lead TSOP Package
    • ETOX™ VIII (0.13 µm), ETOX™ VII (0.18 µm), and ETOX™ VI (0.25 µm) Flash Technology options with different capacity ranges

    Application Scenarios

    The TE28F160C3TA90 can be used in various applications that require high-performance asynchronous flash memory. It is suitable for code and data storage in systems that operate within the temperature range of -40 °C to +85 °C. The flexible block locking feature allows for secure and customizable data protection. With low power consumption and extended cycling capability, it is an ideal choice for applications where power efficiency and durability are important.

    Comparison

    Advantages
    • Flexible SmartVoltage Technology for power optimization
    • Optimized architecture for code and data storage
    • Flexible block locking for secure data protection
    • Low power consumption
    • Extended cycling capability
    Disadvantages
    • No specific disadvantages mentioned
  • Similar parts: 430483 , Click to view
    Attributes Value
    Category IC Chips
    Manufacturer INTEL
    Product Category IC Chips
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  • Shopping guide

    Warranty:
    • - 30-day money-back return policy,
    • - 90-day warranty against any manufacturing defects. View more
    Returning:
    Within 30 days from date of shipment. View more

    Delivery period:
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    • - DHL Express: 3-7 business days
    • - DHL eCommerce: 12-22 business days
    • - FedEx International Priority: 3-7 business days
    • - EMS: 10-15 business days
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Additional Information
  • Datasheet: Download TE28F160C3TA90
  • Chipdatas Part: CD94-TE28F160C3TA90
  • Warehouse: China, Hong Kong
  • Dispatch: Within 24 hours
  • Free Shipping: Yes
  • Prority Shipping: Yes, 3-5 days
  • Last Updated: 2024/06/13 22:35 +0800
Refund
    • Full Refund if you don't receive your order
    • Full or Partial Refund , If the item is not as described
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