5105457W80 - Brand New Intel / Altera IC Chips
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Description
Electronic Component Model: 5105457W80 is a subminiature size IC Chip that is designed for use in adverse environments. It features a sealed construction with epoxy resin and rubber cap, ensuring resistance to contaminants such as dust. With a conforming IP67 protective construction classification, it offers reliable performance even in challenging conditions. This model also utilizes elastomer double molding technology and ultrasonic swaging technology to achieve uniform sealing in high production quantities. Additionally, it offers an expansion of low-level circuit type and a specially developed Au clad 2-ply contact type for small current and voltage loads in the range of 1 mA to 100 mA and 5 V to 30 V. It is UL/CSA/VDE/SEMKO approved, although VDE and SEMKO approval is not applicable for the Au-clad twin layer variant.
Specifications and features
• Subminiature size (19.8×11.1×6.4 mm)
• Sealed construction for use in adverse environment-Sealed construction by
epoxy resin and rubber cap greatly reduces possible miscontact due to
contaminants such as dust. Conforming to IP67 of IEC protective construction
classification
• Elastomer double molding technology, an industry first and ultrasonic swaging
technology contribute to uniform sealing in high production quantities
• Expansion of low-level circuit type
• We offer a Au clad 2-ply contact type (for small loads) that we developed
specifically for small current and voltage loads in the range of 1 mA to 100 mA and 5 V to 30 V.
• UL/CSA/VDE/SEMKO approved
(AS for Au-clad twin layer, VDE and SEMKO are not approved.)
Based on the protective construction classification of IEC, items which satisfy the test requirements are denoted with an IP designation.Application Scenarios
• Automotive
• Home appliances (vacuum cleaner, air purifier)
• Others (gas cooking range)Comparison
Advantages- Subminiature size ideal for applications with space constraints
- Sealed construction ensures reliable performance in adverse environments
- Elastomer double molding technology and ultrasonic swaging technology provide uniform sealing for high production quantities
- Expansion of low-level circuit type allows for versatile usage
- Au clad 2-ply contact type specifically developed for small current and voltage loadsDisadvantages- VDE and SEMKO approval not applicable for Au-clad twin layer variant
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Similar parts: 430483 , Click to view
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Datasheet
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Shopping guide
Delivery period:
- - Will ship out in 2-3 days
- - DHL Express: 3-7 business days
- - DHL eCommerce: 12-22 business days
- - FedEx International Priority: 3-7 business days
- - EMS: 10-15 business days
Shipping fee:
- - Automatic Email notification (above 5 times)
- - View in your order page
Shipping option:
DHL, FedEx, EMS, SF Express, and Registered Air MailShipping tracking:
- - Automatic Email notification (above 5 times)
- - View in your order page
How to Buy:
- - In-stock, Add to cart > Check out > Submit order > Complete payment >Delivery.
- - Inquiry, Add to inquiry sheet/Submit bom/inquire file/Send email us > Quote > Place order > Complete payment >Delivery.
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Payment:
- - Paypal,Credit Card includes Visa, Master, American Express.
- - Wire transfer, include Local bank transfer.
- - Western Union.
- View more
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Popular parts of the same kind
- Datasheet: Download 5105457W80
- Chipdatas Part: CD94-5105457W80
- Warehouse: China, Hong Kong
- Dispatch: Within 24 hours
- Free Shipping: Yes
- Prority Shipping: Yes, 3-5 days
- Last Updated: 2024/06/03 14:26 +0800
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- Full Refund if you don't receive your order
- Full or Partial Refund , If the item is not as described
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The fee is charged according to the rule of PayPal.
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The fee is charged according to the rule of PayPal.
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Western Union charge US$0.00 banking fee.
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We recommend to use bank transfer for large orders to save on handling fees.
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DHL(www.dhl.com)
$40 limited time offer. -
UPS(www.ups.com)
$40 limited time offer. -
FedEx(www.fedex.com)
$40 limited time offer. -
Registered Mail(www.singpost.com)
Free shipping without minimum order.
