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Description
This document contains the specifications for the Intel® Advanced+ Boot Block Flash Memory (C3) Stacked Chip Scale Package (SCSP) device. C3 SCSP memory solutions are offered in different combinations of flash memory and SRAM, providing secure low-voltage memory solutions for portable applications. The flash memory offers enhanced security, instant locking/unlocking of any flash block with zero-latency, a 128-bit protection register for unique device identification, and improved 12V production programming for increased factory throughput.
Specifications and features
- Flash Memory Plus SRAM, which reduces memory board space and simplifies PCB design complexity. - SCSP Technology, with the smallest memory subsystem footprint and different technology options. - Advanced SRAM Technology, with 70 ns access time, low power operation, and low voltage data retention mode. - Intel® Flash Data Integrator (FDI) Software, allowing real-time data storage and code execution in the same memory device. - Advanced+ Boot Block Flash Memory, with fast access time, individual block locking, 128-bit protection register, 12 V production programming, fast program and erase suspend, and extended temperature range. - Blocking Architecture, with code and data storage blocks, 100,000 erase cycles per block, and different block sizes. - Low Power Operation, with low current consumption and automatic power saving mode. - Flash Technologies, including different flash technologies.
Application Scenarios
The Intel® Advanced+ Boot Block Flash Memory (C3) SCSP device is suitable for portable applications that require secure low-voltage memory solutions. It can be used in various electronic devices such as smartphones, tablets, digital cameras, and portable media players.
Comparison
Advantages- Enhanced security features for data protection. - Instant locking/unlocking of any flash block with zero-latency. - Unique device identification with a 128-bit protection register. - Improved factory throughput with 12V production programming. - Compact size and reduced memory board space. - Low power operation and automatic power saving mode. - Different flash technologies available to meet specific requirements.Disadvantages- Not suitable for applications that require large memory capacity. - Limited options for SRAM capacity. -
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Datasheet
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- Last Updated: 2024/06/30 18:59 +0800
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