RD38F1010C0ZTL0-SB48 - Brand New Intel IC Chips
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Description
This document contains the specifications for the Intel® Advanced+ Boot Block Flash Memory (C3) Stacked Chip Scale Package (SCSP) device. C3 SCSP memory solutions are offered in various combinations of flash memory and SRAM. The C3 SCSP device combines flash memory and SRAM into a single package, providing secure low-voltage memory solutions for portable applications. The flash memory of this device offers enhanced security, instant locking/unlocking of flash blocks with zero-latency, a 128-bit protection register for unique device identification, and improved 12 V production programming for increased factory throughput.
Specifications and features
The Intel® Advanced+ Boot Block Flash Memory (C3) Stacked Chip Scale Package (SCSP) device offers the following specifications and features:
- Flash memory plus SRAM, reducing memory board space required and simplifying PCB design complexity.
- SCSP technology, providing the smallest memory subsystem footprint.
- Advanced SRAM technology with low power operation and low voltage data retention mode.
- Intel® Flash Data Integrator (FDI) Software for real-time data storage and code execution in the same memory device.
- Advanced+ Boot Block Flash Memory with individual block locking, 128-bit protection register, 12 V production programming, and extended temperature range.
- Blocking architecture with various block sizes for code and data storage, and 100,000 erase cycles per block.
- Low power operation with automatic power saving mode.
- Flash technologies including 0.25 µm ETOX™ VI, 0.18 µm ETOX™ VII and 0.13 µm ETOX™ VIII Flash Technologies.
Application Scenarios
The Intel® Advanced+ Boot Block Flash Memory (C3) Stacked Chip Scale Package (SCSP) device is suitable for various applications, including but not limited to:
- Portable devices requiring secure low-voltage memory solutions.
- Next generation portable applications that require enhanced security and unique device identification.
Comparison
Advantages- Combines flash memory and SRAM into a single package, reducing memory board space and simplifying PCB design.
- Enhanced security with instant locking/unlocking of flash blocks and a 128-bit protection register.
- Improved 12 V production programming for increased factory throughput.
- Advanced SRAM technology with low power operation and low voltage data retention mode.
- Intel® Flash Data Integrator (FDI) Software for real-time data storage and code execution in the same memory device.
- Blocking architecture with various block sizes and 100,000 erase cycles per block.
Disadvantages- Limited options for flash memory and SRAM combinations.
- The device's small form factor may not be suitable for all applications.
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Datasheet
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Shopping guide
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Additional Information
- Datasheet: Download RD38F1010C0ZTL0-SB48
- Chipdatas Part: CD94-RD38F1010C0ZTL0-SB48
- Warehouse: China, Hong Kong
- Dispatch: Within 24 hours
- Free Shipping: Yes
- Prority Shipping: Yes, 3-5 days
- Last Updated: 2024/06/24 09:19 +0800
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- Full Refund if you don't receive your order
- Full or Partial Refund , If the item is not as described
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