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SPC5675KFF0MMS2 - Brand New Freescale / NXP Microcontrollers - Datasheet - Chipdatas

SPC5675KFF0MMS2 - Brand New Freescale / NXP Microcontrollers

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In Stock: 3029, Ready for Immediate Shipping
Category:Microcontrollers
Chipdatas Part No.:CD93-SPC5675KFF0MMS2
Manufacturer Part No.:SPC5675KFF0MMS2
Datecode:09+
Package:473-LFBGA
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  • SPC5675KFF0MMS2 Description

    The MPC5675K microcontroller, a SafeAssure solution, is a 32-bit embedded controller designed for advanced driver assistance systems with RADAR, CMOS imaging, LIDAR and ultrasonic sensors, and multiple 3-phase motor control applications as in hybrid electric vehicles (HEV) in automotive and high temperature industrial applications.
    A member of NXP Semiconductor’s MPC5500/5600 family, it contains the Book E compliant Power [email protected] technology core with Variable Length Encoding (VLE). This core complies with the Power Architecture embedded category, and is 100 percent user mode compatible with the original Power PC™ user instruction set architecture (UISA). It offers system performance up to four times that of its MPC5561 predecessor, while bringing you the reliability and familiarity of the proven Power Architecture technology.
    A comprehensive suite of hardware and software development tools is available to help simplify and speed system design. Development support is available from leading tools vendors providing compilers, debuggers and simulation development environments.

    SPC5675KFF0MMS2 Features

    • High-performance e200z7d dual core
    — 32-bit Power Architecture technology CPU
    — Up to 180 MHz core frequency
    — Dual-issue core
    — Variable length encoding (VLE)
    — Memory management unit (MMU) with 64 entries
    — 16 KB instruction cache and 16 KB data cache
    • Memory available
    — Up to 2 MB code flash memory with ECC
    — 64 KB data flash memory with ECC
    — Up to 512 KB on-chip SRAM with ECC
    • SIL3/ASILD innovative safety concept: LockStep mode and fail-safe protection
    — Sphere of replication (SoR) for key components
    — Redundancy checking units on outputs of the SoR connected to FCCU
    — Fault collection and control unit (FCCU)
    — Boot-time built-in self-test for memory (MBIST) and logic (LBIST) triggered by hardware
    — Boot-time built-in self-test for ADC and flash memory
    — Replicated safety-enhanced watchdog timer
    — Silicon substrate (die) temperature sensor
    — Non-maskable interrupt (NMI)
    — 16-region memory protection unit (MPU)
    — Clock monitoring units (CMU)
    — Power management unit (PMU)
    — Cyclic redundancy check (CRC) units
    • Decoupled Parallel mode for high-performance use of replicated cores
    • Nexus Class 3+ interface
    • Interrupts
    — Replicated 16-priority interrupt controller
    • GPIOs individually programmable as input, output, or special function
    • 3 general-purpose eTimer units (6 channels each)
    • 3 FlexPWM units with four 16-bit channels per module
    • Communications interfaces
    — 4 LINFlex modules
    — 3 DSPI modules with automatic chip select generation
    — 4 FlexCAN interfaces (2.0B Active) with 32 message objects
    — FlexRay module (V2.1) with dual channel, up to 128 message objects and up to 10 Mbit/s
    — Fast Ethernet Controller (FEC)
    — 3 I2C modules
    • Four 12-bit analog-to-digital converters (ADCs)
    — 22 input channels
    — Programmable cross triggering unit (CTU) to synchronize ADC conversion with timer and PWM
    • External bus interface
    • 16-bit external DDR memory controller
    • Parallel digital interface (PDI)

    • On-chip CAN/UART bootstrap loader
    • Capable of operating on a single 3.3 V voltage supply
    — 3.3 V-only modules: I/O, oscillators, flash memory
    — 3.3 V or 5 V modules: ADCs, supply to internal VREG
    — 1.8–3.3 V supply range: DRAM/PDI
    • Operating junction temperature range –40 to 150 °C

  • Similar parts: 10206 , Click to view
    Attributes Value
    Category Microcontrollers
    Manufacturer Freescale / NXP
    Product Category Microcontrollers
    Series MPC56xx Qorivva
    Packaging Tray
    Package-Case 473-LFBGA
    Operating-Temperature -40°C ~ 125°C (TA)
    Supplier-Device-Package 473-MAPBGA (19x19)
    Number-of-I-O
    Speed 180MHz
    EEPROM-Size 64K x 8
    Core-Processor e200z7d
    RAM-Size 512K x 8
    Program Memory FLASH
    Peripherals DMA, POR, PWM, WDT
    Connectivity CAN, EBI/EMI, Ethernet, FlexRay, I2C, LIN, SPI
    Voltage-Supply-Vcc-Vdd 1.14 V ~ 1.32 V
    Core-Size 32-Bit
    Program-Memory-Size 2MB (2M x 8)
    Data-Converters A/D 34x12b
    Oscillator-Type Internal
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  • Datasheet: Download SPC5675KFF0MMS2
  • Chipdatas Part: CD93-SPC5675KFF0MMS2
  • Warehouse: China, Hong Kong
  • Dispatch: Within 24 hours
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  • Last Updated: 2024/06/30 18:22 +0800
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