Description

Electronic Component Model: 117-93-656-41-005000 is an IC socket used for high-density DIP devices with .070" lead spacing. It is part of the MILL-MAX series 117, 127, 217, 227, 317, and 327. This socket is available in shrink dip, solder tail, and wrapost configurations. The solder tails use MM #1802 receptacles, while the wraposts use MM #1702-2 or 1703-3 receptacles. The socket features a high-reliability, 4-finger BeCu #30 contact that is rated at 3 amps. The insulators are made of high-temperature thermoplastic, making them suitable for all soldering operations. For more information regarding electrical, mechanical, and environmental data, please refer to page 264.

Specifications and features

- IC socket for high-density DIP devices

- .070" lead spacing

- Available in shrink dip, solder tail, and wrapost configurations

- Solder tails use MM #1802 receptacles

- Wraposts use MM #1702-2 or 1703-3 receptacles

- High-reliability, 4-finger BeCu #30 contact rated at 3 amps

- Insulators made of high-temperature thermoplastic for all soldering operations

Application Scenarios

- Suitable for devices with .070" lead spacing

- Used for high-density DIP devices

Comparison