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A3P400-FGG144I - Brand New Microchip Technology FPGAs (Field Programmable Gate Array) - Datasheet - Chipdatas

A3P400-FGG144I - Brand New Microchip Technology FPGAs (Field Programmable Gate Array)

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Chipdatas Part No.:CD93-A3P400-FGG144I
Manufacturer Part No.:A3P400-FGG144I
Datecode:09+
Package:FBGA
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  • Description

    A3P400-FGG144I is a model of electronic component belonging to the category of FPGAs (Field Programmable Gate Array). It is part of the ProASIC3 family of Actel flash FPGAs, which offers superior performance, density, and features compared to the ProASICPLUS® family. With its nonvolatile flash technology, the ProASIC3 devices provide a secure, low-power, single-chip solution that is live at power-up (LAPU). They are reprogrammable and offer time-to-market benefits at an ASIC-level unit cost, allowing designers to create high-density systems using existing ASIC or FPGA design flows and tools.

    Specifications and features

    • High Capacity: 15 k to 1 M System Gates, Up to 144 kbits of True Dual-Port SRAM, Up to 300 User I/Os
    • Reprogrammable Flash Technology: 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process, Live at Power-Up (LAPU) Level 0 Support, Single-Chip Solution, Retains Programmed Design when Powered Off
    • High Performance: 350 MHz System Performance, 3.3 V, 66 MHz 64-Bit PCI†
    • In-System Programming (ISP) and Security: Secure ISP Using On-Chip 128-Bit Advanced Encryption Standard (AES) Decryption (except ARM-enabled ProASIC®3 devices) via JTAG (IEEE 1532–compliant)†, FlashLock® to Secure FPGA Contents
    • Low Power: Core Voltage for Low Power, Support for 1.5 V-Only Systems, Low-Impedance Flash Switches
    • High-Performance Routing Hierarchy: Segmented, Hierarchical Routing and Clock Structure
    • Advanced I/O: 700 Mbps DDR, LVDS-Capable I/Os (A3P250 and above), Mixed-Voltage Operation (1.5 V, 1.8 V, 2.5 V, and 3.3 V), Bank-Selectable I/O Voltages (up to 4 Banks per Chip), Various Single-Ended and Differential I/O Standards, I/O Registers on Input, Output, and Enable Paths, Hot-Swappable and Cold Sparing I/Os‡, Programmable Output Slew Rate† and Drive Strength, Weak Pull-Up/-Down, IEEE 1149.1 (JTAG) Boundary Scan Test, Pin-Compatible Packages across the ProASIC3 Family
    • Clock Conditioning Circuit (CCC) and PLL†: Six CCC Blocks, One with an Integrated PLL, Configurable Phase-Shift, Multiply/Divide, Delay Capabilities and External Feedback, Wide Input Frequency Range (1.5 MHz to 350 MHz)
    • Embedded Memory†: 1 kbit of FlashROM User Nonvolatile Memory, SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9, and ×18 organizations)†, True Dual-Port SRAM (except ×18)
    • ARM Processor Support in ProASIC3 FPGAs: M1 and M7 ProASIC3 Devices—Cortex-M1 and CoreMP7 Soft Processor Available with or without Debug

    Application Scenarios

    The A3P400-FGG144I electronic component is suitable for a wide range of application scenarios. It can be used in high-density systems, leveraging existing ASIC or FPGA design flows and tools. Its reprogrammable nature and time-to-market benefits make it ideal for designing complex electronics. Additionally, its low power consumption and secure flash technology make it a reliable choice for various industries.

    Comparison

    Advantages
    • Superior performance, density, and features compared to previous generations
    • Secure, low-power, single-chip solution with live at power-up capability
    • Reprogrammable and offers time-to-market benefits at an ASIC-level unit cost
    • High capacity with ample system gates, dual-port SRAM, and user I/Os
    • Supports various I/O standards and voltages for flexibility
    • Advanced features such as in-system programming, security encryption, and clock conditioning circuit
    Disadvantages
    • Not suitable for applications requiring very low power consumption
    • Limited availability of ARM processor support for certain devices
  • Similar parts: 3140 , Click to view
    Attributes Value
    Category FPGAs (Field Programmable Gate Array)
    Manufacturer Microchip Technology
    Product Category FPGAs (Field Programmable Gate Array)
    Series ProASIC3
    Unit-Weight 0.014110 oz
    Mounting-Style SMD/SMT
    Tradename Actel
    Package-Case FBGA
    Operating-Temperature -40°C ~ 100°C (TJ)
    Mounting-Type Surface Mount
    Voltage-Supply 1.425 V ~ 1.575 V
    Supplier-Device-Package 144-FPBGA (13x13)
    IC Number of Gates 400000
    Number-of-I-O 97 I/O
    Number-of-LABs-CLBs
    Number-of-Logic-Elements-Cells
    Total-RAM-Bits 55296 Bits
    Maximum Operating Temperature + 85 C
    Operating temperature range - 40 C
    Operating-Supply-Voltage 1.5 V
    Maximum-Operating-Frequency 231 MHz
    Input/output 97 I/O
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Additional Information
  • Datasheet: Download A3P400-FGG144I
  • Chipdatas Part: CD93-A3P400-FGG144I
  • Warehouse: China, Hong Kong
  • Dispatch: Within 24 hours
  • Free Shipping: Yes
  • Prority Shipping: Yes, 3-5 days
  • Last Updated: 2024/06/13 08:14 +0800
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    • Full or Partial Refund , If the item is not as described
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