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EP2C35F672I8N - Brand New Intel / Altera FPGAs (Field Programmable Gate Array) - Datasheet - Chipdatas

EP2C35F672I8N - Brand New Intel / Altera FPGAs (Field Programmable Gate Array)

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In Stock: 6140, Ready for Immediate Shipping
Chipdatas Part No.:CD86-EP2C35F672I8N
Manufacturer Part No.:EP2C35F672I8N
Datecode:09+
Package:672-BGA
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  • Description

    EP2C35F672I8N is an FPGA (Field Programmable Gate Array) electronic component model manufactured by Altera. The FPGA belongs to the Cyclone II device family and offers a high-density architecture with a range of 4,608 to 68,416 logic elements (LEs). It provides up to 622 usable I/O pins and up to 1.1 Mbits of embedded memory. Cyclone II FPGAs are built on 300-mm wafers using TSMCs 90-nm low-k dielectric process to ensure low cost and rapid availability.

    Specifications and features

    The Cyclone II device family offers several features, including:

    • High-density architecture with 4,608 to 68,416 LEs
    • M4K embedded memory blocks
    • Up to 1.1 Mbits of RAM available without reducing available logic
    • 4,096 memory bits per block (4,608 bits per block including 512 parity bits)
    • Variable port configurations of ×1, ×2, ×4, ×8, ×9, ×16, ×18, ×32, and ×36
    • True dual-port (one read and one write, two reads, or two writes) operation for ×1, ×2, ×4, ×8, ×9, ×16, and ×18 modes
    • Byte enables for data input masking during writes
    • Up to 260-MHz operation
    • Embedded multipliers (up to 150 18- × 18-bit multipliers are each configurable as two independent 9- × 9-bit multipliers with up to 250-MHz performance)
    • High-speed differential I/O standard support, including LVDS, RSDS, mini-LVDS, LVPECL, differential HSTL, and differential SSTL
    • Single-ended I/O standard support, including 2.5-V and 1.8-V, SSTL class I and II, 1.8-V and 1.5-V HSTL class I and II, 3.3-V PCI and PCI-X 1.0, 3.3-, 2.5-, 1.8-, and 1.5-V LVCMOS, and 3.3-, 2.5-, and 1.8-V LVTTL
    • Peripheral Component Interconnect Special Interest Group (PCI SIG) PCI Local Bus Specification, Revision 3.0 compliance for 3.3-V operation at 33 or 66 MHz for 32- or 64-bit interfaces
    • PCI Express with an external TI PHY and an Altera PCI Express ×1 Megacore® function
    • 133-MHz PCI-X 1.0 specification compatibility
    • High-speed external memory support, including DDR, DDR2, and SDR SDRAM, and QDRII SRAM supported by drop in Altera IP MegaCore functions for ease of use
    • Three dedicated registers per I/O element (IOE): one input register, one output register, and one output-enable register
    • Programmable bus-hold feature
    • Programmable output drive strength feature
    • Programmable delays from the pin to the IOE or logic array
    • I/O bank grouping for unique VCCIO and/or VREF bank settings
    • MultiVolt™ I/O standard support for 1.5-, 1.8-, 2.5-, and 3.3-interfaces
    • Hot-socketing operation support
    • Tri-state with weak pull-up on I/O pins before and during configuration
    • Programmable open-drain outputs
    • Series on-chip termination support

    Application Scenarios

    The EP2C35F672I8N FPGA can be used in various applications that require high-density programmable logic resources, high-speed external memory interfaces, and high-speed I/O performance. It can be used in communication systems, industrial control, military and aerospace systems, and various other electronic systems.

    Comparison

    Advantages
    • Offers a high-density programmable logic and memory resources
    • Supports a wide range of external memory interfaces
    • Provides high-speed I/O performance
    • Compliant with several I/O standards, including PCI SIG PCI Local Bus Specification, Revision 3.0, PCI-X 1.0 specification, and multiVolt™ I/O standard support for 1.5-, 1.8-, 2.5-, and 3.3-interfaces
    Disadvantages
    • May not be the best option for applications that require low power consumption
    • Some features may not be needed for certain applications and could drive up the cost of the solution
  • Similar parts: 3140 , Click to view
    Attributes Value
    Category FPGAs (Field Programmable Gate Array)
    Manufacturer Intel / Altera
    Product Category FPGAs (Field Programmable Gate Array)
    Series Cyclone® II
    Product Cyclone II
    Packaging Tray
    Mounting-Style SMD/SMT
    Tradename Cyclone II
    Package-Case FBGA-672
    Operating-Temperature -40°C ~ 100°C (TJ)
    Mounting-Type Surface Mount
    Voltage-Supply 1.15 V ~ 1.25 V
    Supplier-Device-Package 672-FBGA (27x27)
    IC Number of Gates -
    Number-of-I-O 475 I/O
    Number-of-LABs-CLBs 2076
    Number-of-Logic-Elements-Cells 33216
    Total-RAM-Bits 483840 Bits
    Maximum Operating Temperature + 85 C
    Operating temperature range - 40 C
    Operating-Supply-Voltage 1.15 V to 1.25 V
    Maximum-Operating-Frequency 260 MHz
    Input/output 475 I/O
    Number-of-Logic-Array-Blocks-LABs 2076
    Number-of-Logic-Elements 33216 Logic Elements
    Total-Memory 483840 bit
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Additional Information
  • Datasheet: Download EP2C35F672I8N
  • Chipdatas Part: CD86-EP2C35F672I8N
  • Warehouse: China, Hong Kong
  • Dispatch: Within 24 hours
  • Free Shipping: Yes
  • Prority Shipping: Yes, 3-5 days
  • Last Updated: 2024/06/12 13:04 +0800
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    • Full or Partial Refund , If the item is not as described
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