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Description
Preface
The objective of this data sheet is to define the functionality of the Super Mapper for hardware and software developers. The information contained in this data sheet is preliminary, and may change without notice; the reader must therefore ascertain that the latest version is used when a product is under development.
The latest version of this data sheet can be accessed at: http://www.lucent.com/micro/netcom/products/pdh.html#super_mapperSpecifications and features
■ Versatile IC supports 155/51 Mbits/s SONET/SDH interface solutions for T3/E3, DS2, T1/E1/J1, and DS0/E0/J0 applications.
■ Implementation supports both linear (1 + 1, unprotected) and ring (UPSR) network topologies.
■ Provides full termination of up to 21 E1, 28 T1, or 28 J1.
■ Low power 3.3 V supply.
■ –40 °C to +85 °C industrial temperature range.
■ 456-pin ball grid array (PBGA) package.
■ Complies with Bellcore*, ITU, ANSI †, ETSI and Japanese TTC standards: GR-253-CORE, GR-499, (ATT) TR-62411, ITU-T G.707, G.704, G.706, G.783, G.962, G.964, G.965, Q.542, T1.105, JT-G704, JT-G706, JT-G707, JT-I431-a, ETS 300 417-1-1, ETS 300 011, T1.107, T1.404.Application Scenarios
This electronic component model TMXL200 can be used in various scenarios such as T3/E3, DS2, T1/E1/J1, and DS0/E0/J0 applications where 155/51 Mbits/s SONET/SDH interface solutions are required. It supports both linear (1 + 1, unprotected) and ring (UPSR) network topologies, providing full termination of up to 21 E1, 28 T1, or 28 J1. With its low power 3.3 V supply and industrial temperature range of –40 °C to +85 °C, it ensures reliable performance. The 456-pin ball grid array (PBGA) package makes it easy to install.
Comparison
Advantages- Versatile IC supporting various interface solutions for different applications.
- Supports both linear and ring network topologies.
- Provides full termination of multiple signal types.
- Low power consumption.
- Wide industrial temperature range.
- Easy installation with the 456-pin ball grid array (PBGA) package.
- Complies with industry standards.Disadvantages- Preliminary data sheet, subject to change without notice.
- Reader must ensure the latest version is used for product development.
- External link for the latest version of the data sheet. -
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Datasheet
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- Datasheet: Download TMXL200
- Chipdatas Part: CD94-TMXL200
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- Last Updated: 2024/06/14 00:13 +0800
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