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Description
This document provides information about the Intel StrataFlash® Embedded Memory (P30) device and describes its features, operation, and specifications. The Electronic Component Model is RC28F256P30T, belonging to the Memory product category.
Specifications and features
- High performance: - 85/88 ns initial access - 40 MHz with zero wait states, 20 ns clock-to data output synchronous-burst read mode - 25 ns asynchronous-page read mode - 4-, 8-, 16-, and continuous-word burst mode - Buffered Enhanced Factory Programming (BEFP) at 5 µs/byte (Typ) - 1.8 V buffered programming at 7 µs/byte (Typ) - Architecture: - Multi-Level Cell Technology: Highest Density at Lowest Cost - Asymmetrically-blocked architecture - Four 32-KByte parameter blocks: top or bottom configuration - 128-KByte main blocks - Voltage and Power: - VCC(core) voltage: 1.7 V – 2.0 V - VCCQ (I/O) voltage: 1.7 V – 3.6 V - Standby current: 55 µA (Typ) for 256-Mbit - 4-Word synchronous read current: 13 mA (Typ) at 40 MHz - Quality and Reliability: - Operating temperature: –40 °C to +85 °C - 1-Gbit in SCSP is –30 °C to +85 °C - Minimum 100,000 erase cycles per block - ETOX™ VIII process technology (130 nm) - Security: - One-Time Programmable Registers: - 64 unique factory device identifier bits - 64 user-programmable OTP bits - Additional 2048 user-programmable OTP bits - Selectable OTP Space in Main Array: - 4x32KB parameter blocks + 3x128KB main blocks (top or bottom configuration) - Absolute write protection: VPP= VSS - Power-transition erase/program lockout - Individual zero-latency block locking - Individual block lock-down - Software: - 20 µs (Typ) program suspend - 20 µs (Typ) erase suspend - Intel® Flash Data Integrator optimized - Basic Command Set and Extended Command Set compatible - Common Flash Interface capable - Density and Packaging: - 64/128/256-Mbit densities in 56-Lead TSOP package - 64/128/256/512-Mbit densities in 64-Ball Intel®Easy BGA package - 64/128/256/512-Mbit and 1-Gbit densities in Intel®QUAD+ SCSP - 16-bit wide data bus
Application Scenarios
The Electronic Component Model RC28F256P30T can be used in various applications, including: - Embedded systems - Automotive electronics - Industrial automation - Telecommunications - Medical devices
Comparison
The advantages of the RC28F256P30T model are: - High performance with fast initial access and synchronous-burst read mode - Multi-Level Cell Technology for highest density at lowest cost - Wide range of voltage compatibility - Quality and reliability with high temperature tolerance and minimum 100,000 erase cycles per block - Security features including one-time programmable registers and block locking - Software optimization and compatibility - Wide range of density options and packaging choices - Suitable for various applications in embedded systems, automotive electronics, industrial automation, telecommunications, and medical devices. The disadvantages of the RC28F256P30T model are currently unknown.
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Datasheet
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Shopping guide
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Popular parts of the same kind
- Datasheet: Download RC28F256P30T
- Chipdatas Part: CD94-RC28F256P30T
- Warehouse: China, Hong Kong
- Dispatch: Within 24 hours
- Free Shipping: Yes
- Prority Shipping: Yes, 3-5 days
- Last Updated: 2024/06/23 10:45 +0800
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