CY7C1354C-200BGXC - Brand New Cypress Semiconductor IC Chips
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Description
The CY7C1354C-200BGXC is an IC chip that belongs to the SRAM Category. It is optimized for 100% bus utilization and achieve Zero Bus Latency™ (ZBL™)/No Bus Latency™ (NoBL™). It integrates 262,144 × 36 and 524,288 × 18 SRAM cells, respectively, with advanced synchronous peripheral circuitry and a two-bit counter for internal burst operation. They employ high-speed, low-power CMOS designs using advanced triple-layer polysilicon, double-layer metal technology. Each memory cell consists of four transistors and two high-valued resistors.
Specifications and features
- Category: IC Chip
- Technology: Zero Bus Latency™ (ZBL™)/No Bus Latency™ (NoBL™)
- Capacity: 262,144 × 36 and 524,288 × 18 SRAM cells
- Fast Clock Speed: 200, 166, 133, 100 MHz
- Access Time: 3.2, 3.6, 4.2, 5.0 ns
- Single 3.3V –5% and +5% power supply VCC and separate VCCQ for 3.3V or 2.5V I/O
- Internally synchronized registered outputs eliminate the need to control OE
- Positive clock-edge triggered, address, data, and control signal registers for fully pipelined applications
- Interleaved or linear four-word burst capability
- Individual byte Write (BWa–BWd) control (may be tied LOW)
- CEN pin to enable clock and suspend operations
- Three chip enables for simple depth expansion
- Automatic power-down feature available using ZZ mode or CE select
- JTAG boundary scan
- Low-profile 119-bump, 14-mm × 22-mm BGA (Ball Grid Array), and 100-pin TQFP packages
Application Scenarios
The CY7C1354C-200BGXC IC chip can be used in several electronic devices that require high-speed, low-power SRAM chips to achieve advanced performance. For example, it can be used in networking devices, routers, switches, security systems, data centers, and storage devices for efficient data storage and retrieval.
Comparison
Advantages- Zero Dead Cycles between Write and Read Cycles
- Fast Clock Speed and Access Time
- Internally synchronized registered outputs eliminate the need to control OE
- Automatic Power-Down Feature and Three Chip Enables for simple depth expansion
- JTAG boundary scan
Disadvantages- May not be compatible with all electronic devices
- Packages available in limited variants
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Similar parts: 430483 , Click to view
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Datasheet
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Shopping guide
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Popular parts of the same kind
- Datasheet: Download CY7C1354C-200BGXC
- Chipdatas Part: CD86-CY7C1354C-200BGXC
- Warehouse: China, Hong Kong
- Dispatch: Within 24 hours
- Free Shipping: Yes
- Prority Shipping: Yes, 3-5 days
- Last Updated: 2024/10/01 09:01 +0800
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