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Description
This document contains the specifications for the Intel® Advanced+ Boot Block Flash Memory (C3) Stacked Chip Scale Package (SCSP) device. The C3 SCSP device combines flash memory and SRAM into a single package, providing secure low-voltage memory solutions for portable applications. It offers enhanced security, instant locking/unlocking of flash blocks with zero-latency, and a 128-bit protection register for unique device identification. The device also features improved 12V production programming for increased factory throughput.
Specifications and features
- Flash Memory Plus SRAM reduces memory board space required, simplifying PCB design complexity.
- The SCSP technology allows for the smallest memory subsystem footprint. It has an area of 8 x 10 mm for 16 Mbit (0.13 µm) Flash + 2 Mbit or 4 Mbit SRAM, and 8 x 12 mm for 32 Mbit (0.13 µm) Flash + 4 Mbit or 8 Mbit SRAM. The height is 1.20 mm for 16 Mbit Flash + 2 Mbit or 4 Mbit SRAM, and 32 Mbit (0.13 µm) Flash + 8 Mbit SRAM. The technology is also available in 0.25 µm, 0.18 µm, and 0.13 µm technologies.
- The Advanced SRAM Technology has a 70 ns access time, low power operation, and low voltage data retention mode.
- The Intel® Flash Data Integrator (FDI) Software allows for real-time data storage and code execution in the same memory device. It has full Flash File Manager capability.
- The Advanced+ Boot Block Flash Memory features a 70 ns access time, instant individual block locking, a 128-bit protection register, 12V production programming, fast program and erase suspend, and extended temperature range (-25 °C to +85 °C).
- The blocking architecture consists of 4-Kword parameter blocks and 64-Kbyte main blocks. Each block can go through 100,000 erase cycles per block.
- The device operates in low power mode with an asynchronous read current of 9 mA (Flash), standby current of 7 µA (Flash), and automatic power saving mode.
- The Flash Technologies available are 0.25 µm ETOX™ VI, 0.18 µm ETOX™ VII, and 0.13 µm ETOX™ VIII Flash Technologies.
Application Scenarios
The Intel® Advanced+ Boot Block Flash Memory (C3) Stacked Chip Scale Package (SCSP) device is suitable for various portable applications such as smartphones, tablets, and other handheld devices that require secure low-voltage memory solutions. It is also ideal for applications that require instant locking and unlocking of flash blocks, unique device identification, and increased factory throughput.
Comparison
Advantages- Enhanced security with instant locking/unlocking of flash blocks
- 128-bit protection register for unique device identification
- Reduced memory board space required, simplifying PCB design complexity
- Multiple size options available (16-Mbit flash + 2-Mbit/4-Mbit SRAM and 32-Mbit flash + 4-Mbit/8-Mbit SRAM)
- Improved 12V production programming for increased factory throughput
- Low power operation with low voltage data retention mode
- Real-time data storage and code execution in the same memory device with the Intel® Flash Data Integrator (FDI) Software
- Block architecture with 4-Kword parameter blocks and 64-Kbyte main blocks
- Extended temperature range (-25 °C to +85 °C)
Disadvantages- Height of the device is 1.20 mm for 16 Mbit Flash + 2 Mbit or 4 Mbit SRAM, and 32 Mbit (0.13 µm) Flash + 4 Mbit SRAM, which may impact certain space-constrained applications.
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Datasheet
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