LFE3-70EA-7FN1156I - Lattice Semiconductor - FPGAs (Field Programmable Gate Array)
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Description
The LatticeECP3™ (EConomy Plus Third generation) family of FPGA devices, model LFE3-70EA-7FN1156I, is optimized to deliver high performance features in an economical FPGA fabric. With an enhanced DSP architecture, high speed SERDES, and high-speed source synchronous interfaces, these devices are suitable for high-volume, high-speed, low-cost applications.
Specifications and features
- Logic Density: 17K to 149K LUTs
- Number of I/Os: 116 to 586
- Embedded SERDES: Supports data rates from 150 Mbps to 3.2 Gbps for various protocols such as PCI Express, SONET/SDH, Ethernet, CPRI, SMPTE 3G, and Serial RapidIO
- sysDSP™: Fully cascadable slice architecture with 12 to 160 slices, powerful 54-bit ALU operations, and support for high-performance multiply and accumulate operations
- Flexible Memory Resources: Up to 6.85Mbits sysMEM™ Embedded Block RAM (EBR) and 36K to 303K bits distributed RAM
- sysCLOCK Analog PLLs and DLLs: Two DLLs and up to ten PLLs per device
- Pre-Engineered Source Synchronous I/O: Supports various source synchronous standards and DDR memory with DQS support
- Programmable sysI/O™ Buffer: Supports a wide range of interfaces and on-chip termination
- Flexible Device Configuration: Offers dedicated bank for configuration I/Os, SPI boot flash interface, dual-boot images, TransFR™ I/O for field updates, and soft error detect embedded macro
- System Level Support: IEEE 1149.1 and IEEE 1532 compliant, Reveal Logic Analyzer, ORCAstra FPGA configuration utility, and on-chip oscillator for initialization and general use
- Power Supply: 1.2 V core power supplyApplication Scenarios
The LFE3-70EA-7FN1156I FPGA is commonly used in applications that require high performance and system integration, such as:
- Wireless communication systems - Network infrastructure devices - Video processing and broadcasting equipment - Automotive electronics - Industrial control systemsComparison
Advantages- High logic density allows for increased system integration
- Embedded SERDES supports high-speed data transfer across various protocols
- Powerful sysDSP™ architecture enables high-performance multiply and accumulate operations
- Flexible memory resources provide ample storage for complex applications
- Programmable sysI/O™ Buffer supports a wide range of interfaces
- Flexible device configuration options allow for easy field updates
- System-level support ensures compliance and ease of use
- Low power consumption with 1.2 V core power supplyDisadvantages- Limited logic density options compared to some other FPGA models
- Limited number of I/Os for larger-scale applications -
Similar parts: 3140 , Click to view
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Datasheet
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Shopping guide
Delivery period:
- - Will ship out in 2-3 days
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- Datasheet: Download LFE3-70EA-7FN1156I
- Chipdatas Part: CD94-LFE3-70EA-7FN1156I
- Warehouse: China, Hong Kong
- Dispatch: Within 24 hours
- Free Shipping: Yes
- Prority Shipping: Yes, 3-5 days
- Last Updated: 2024/06/12 09:19 +0800
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- Full Refund if you don't receive your order
- Full or Partial Refund , If the item is not as described
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