LCMXO1200C-3FTN256C - Brand New Lattice Semiconductor Programmable Logic Device (CPLDs/FPGAs)
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Brand:Lattice Semiconductor
Chipdatas Part No.:CD93-LCMXO1200C-3FTN256C
Manufacturer Part No.:LCMXO1200C-3FTN256C
Datecode:09+
Package:256-LBGA
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Description
The LCMXO1200C-3FTN256C is a member of the MachXO family of programmable logic devices (PLDs) and field-programmable gate arrays (FPGAs). It is designed to meet the requirements of applications traditionally handled by low-capacity FPGAs and complex programmable logic devices (CPLDs), including glue logic, bus bridging, power-up control, bus interfacing, and control logic.
Specifications and features
- Non-volatile, infinitely reconfigurable
- Instant-on – Powers up in microseconds
- Single chip – no external configuration memory required
- Excellent design security, no bitstream to intercept
- Reconfigure SRAM-based logic in milliseconds
- SRAM and non-volatile memory programmable through JTAG port
- Supports background programming of non-volatile memory
- Sleep mode – Allows up to 100x static current reduction
- TransFR™ Reconfiguration (TFR) – In-field logic update while system operates
- High I/O to logic density, ranging from 256 to 2280 LUT4s
- 73 to 271 I/Os with extensive package options available
- Density migration supported
- Lead free/RoHS compliant packaging
- Embedded and distributed memory, up to 27.6 Kbits sysMEM™ Embedded Block RAM and up to 7.5 Kbits distributed RAM. Dedicated FIFO control logic
- Flexible I/O buffer – Programmable sysIO™ buffer supports a wide range of interfaces, including LVCMOS 3.3/2.5/1.8/1.5/1.2, LVTTL, PCI, LVDS, Bus-LVDS, LVPECL, RSDS
- SysCLOCK™ PLLs – Up to two analog PLLs per device, clock multiply, divide, and phase shifting
- System-level support with IEEE Standard 1149.1 Boundary Scan, onboard oscillator, devices operate with 3.3V, 2.5V, 1.8V or 1.2V power supply, and IEEE 1532 compliant in-system programming
Application Scenarios
The LCMXO1200C-3FTN256C can be used in various application scenarios, including but not limited to:
- Bus bridging
- Power-up control
- Glue logic
- Control logic
- Bus interfacing
Comparison
- Advantages
- Low power consumption
- High performance
- Infinitely reconfigurable
- Single-chip solution
- Lead-free/RoHS compliant packaging
- Non-volatile memory reduces the need for an external configuration memory
- Excellent design security with no bitstream to intercept
- Flexible I/O buffer supports a wide range of interfaces
- Disadvantages
- Not suitable for high-capacity applications
- May require additional components depending on the application
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Similar parts: 2518 , Click to view
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Datasheet
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Shopping guide
Delivery period:
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Additional Information
- Datasheet: Download LCMXO1200C-3FTN256C
- Chipdatas Part: CD93-LCMXO1200C-3FTN256C
- Warehouse: China, Hong Kong
- Dispatch: Within 24 hours
- Free Shipping: Yes
- Prority Shipping: Yes, 3-5 days
- Last Updated: 2024/06/24 21:28 +0800
Refund
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- Full Refund if you don't receive your order
- Full or Partial Refund , If the item is not as described
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