HYB18T256160AF-3.7 - Brand New QIMONDA IC Chips
In Stock:483 ,Ready for Immediate Shipping
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In Stock:
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Description
The HYB18T256160AF-3.7 is an electronic component model in the IC chips category. It is a low profile Registered DIMM module based on DDR2 technology. The module has a height of 30.00 mm and is designed to be mounted into 240 pin connector sockets. It is available in three different organisations and densities: 64M x 72 (512MByte), 128M x 72 (1GByte), and 256M x 72 (2GByte).
Specifications and features
- 240-pin Registered 8-Byte ECC Dual-In-Line DDR2 SDRAM Module
- For PC, Workstation, and Server main memory applications
- One rank 64Mb x 72, 128Mb x 72, and two ranks 128Mb x 72 and 256Mb x 72 organizations
- JEDEC standard Double Data Rate 2 Synchronous DRAMs (DDR2 SDRAMs) with +1.8V (±0.1V) power supply
- 512MB and 1GB modules built with 512Mb DDR2 SDRAMs in 60-ball FBGA chipsize packages
- Two versions of 2GB modules built with 63-ball FBGA dual die chipsize packages (2 x 512Mb components) or 60-ball FBGA packages
- Programmable CAS Latencies (3, 4 & 5), Burst Length (4 & 8), and Burst Type
- Auto Refresh and Self Refresh
- All inputs and outputs SSTL_1.8 compatible
- Re-drive for all input signals using register and PLL devices
- OCD (Off-Chip Driver Impedance Adjustment) and ODT (On-Die Termination)
- Serial Presence Detect with E2PROM
- Low Profile Modules form factor: 133.35 mm x 30.00 mm (MO-237)
- Based on JEDEC standard reference card designs
Application Scenarios
The HYB18T256160AF-3.7 electronic component model is ideal for use in various electronic devices and systems. It can be used in PCs, workstations, and servers as main memory modules. Its low profile design and compatibility with JEDEC standards make it suitable for different form factors and applications.
Comparison
Advantages- High-density storage: The module is available in different densities, allowing for higher storage capacity in electronic devices.
- Low profile design: The module has a low profile form factor, making it suitable for compact electronic devices where space is limited.
- Compatibility: The module is based on JEDEC standard reference card designs, ensuring compatibility with a wide range of devices and systems.
- Programmable features: The module supports programmable CAS Latencies, Burst Lengths, and Burst Types, providing flexibility in customization.
Disadvantages- Requires specific connector sockets: The module needs to be mounted into 240 pin connector sockets, limiting its compatibility with devices that do not have this socket type.
- DDR2 technology: The module is based on DDR2 technology, which may be outdated compared to newer DDR3 or DDR4 technologies.
- Limited configurations: The module is available in specific organisations and densities, which may not meet the requirements of all applications.
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Datasheet
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Shopping guide
Delivery period:
- - Will ship out in 2-3 days
- - DHL Express: 3-7 business days
- - DHL eCommerce: 12-22 business days
- - FedEx International Priority: 3-7 business days
- - EMS: 10-15 business days
Shipping fee:
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- - View in your order page
Shipping option:
DHL, FedEx, EMS, SF Express, and Registered Air MailShipping tracking:
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How to Buy:
- - In-stock, Add to cart > Check out > Submit order > Complete payment >Delivery.
- - Inquiry, Add to inquiry sheet/Submit bom/inquire file/Send email us > Quote > Place order > Complete payment >Delivery.
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Additional Information
- Datasheet: Download HYB18T256160AF-3.7
- Chipdatas Part: CD94-HYB18T256160AF-3.7
- Warehouse: China, Hong Kong
- Dispatch: Within 24 hours
- Free Shipping: Yes
- Prority Shipping: Yes, 3-5 days
- Last Updated: 2024/06/03 08:02 +0800
Refund
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- Full Refund if you don't receive your order
- Full or Partial Refund , If the item is not as described
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