WTB26PR7J342 - Brand New AIRBORN IC Chips
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Description
The W25M02GW (2 x 1G-bit) Serial MCP (Multi Chip Package) Flash memory is based on the W25N Serial SLC NAND SpiFlash® series by stacking two individual W25N01GW die into a standard 8-pin package. It offers the highest memory density for the low pin-count package, as well as Concurrent Operations in Serial Flash memory for the first time. The W25M SpiStack® series is ideal for small form factor system designs, and applications that demand high Program/Erase data throughput. All W25N SpiFlash family devices are offered in space-saving packages which were impossible to use in the past for the typical NAND flash memory.
Specifications and features
• New Family of SpiFlash Memories
– W25M02GW: 2x1G-bit / 2x128M-Byte
– Standard SPI: CLK, /CS, DI, DO, /WP, /HOLD
– Dual SPI: CLK, /CS, IO0, IO1, /WP, /HOLD
– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
– Compatible SPI serial flash commands
• Highest Performance Serial NAND Flash
– 104MHz Standard/Dual/Quad SPI clocks
– 208/416MHz equivalent Dual/Quad SPI
– 40MB/S continuous data transfer rate
– Fast Program/Erase performance
– More than 100,000 erase/program cycles
– More than 10-year data retention
• Efficient “Continuous Read Mode”(1)
– Alternative method to the Buffer Read Mode
– No need to issue “Page Data Read” between
Read commands
– Allows direct read access to the entire array
• Flexible “Concurrent Operations”
– Independent single die access
– Allows “Read while Program/Erase”
– Allows “Multi Die Program/Erase”
– Improves Program/Erase throughput
• Low Power, Wide Temperature Range
– Single 1.70 to 1.95V supply
– 25mA active, 20µA standby current
– -40°C to +85°C operating range
• Flexible Architecture with 128KB blocks
– Uniform 128K-Byte Block Erase
– Flexible page data load methods
• Advanced Features
– On chip 1-Bit ECC for memory array
– ECC status bits indicate ECC results
– bad block management and LUT(2) access
– Software and Hardware Write-Protect
– Power Supply Lock-Down and OTP protection
– 2KB Unique ID and 2KB parameter pages
– Ten 2KB OTP pages(3)
• Space Efficient Packaging
– 8-pad WSON 8x6-mm
– 24-ball TFBGA 8x6-mm
– Contact Winbond for other package optionsApplication Scenarios
The W25M SpiStack® series is ideal for small form factor system designs and applications that demand high Program/Erase data throughput. It is suitable for use in various electronic devices that require reliable, high-density storage with low pin-count packages.
Comparison
Advantages- Highest memory density for low pin-count package
- Concurrent Operations in Serial Flash memory
- Suitable for small form factor system designs
- High Program/Erase data throughput
- Space-saving packages
Disadvantages- None mentioned
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Similar parts: 430483 , Click to view
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Datasheet
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Shopping guide
Delivery period:
- - Will ship out in 2-3 days
- - DHL Express: 3-7 business days
- - DHL eCommerce: 12-22 business days
- - FedEx International Priority: 3-7 business days
- - EMS: 10-15 business days
Shipping fee:
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Shipping option:
DHL, FedEx, EMS, SF Express, and Registered Air MailShipping tracking:
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How to Buy:
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Popular parts of the same kind
- Datasheet: Download WTB26PR7J342
- Chipdatas Part: CD94-WTB26PR7J342
- Warehouse: China, Hong Kong
- Dispatch: Within 24 hours
- Free Shipping: Yes
- Prority Shipping: Yes, 3-5 days
- Last Updated: 2024/05/21 03:18 +0800
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- Full Refund if you don't receive your order
- Full or Partial Refund , If the item is not as described
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The fee is charged according to the rule of PayPal.
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Western Union charge US$0.00 banking fee.
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