EXB-28V102JX

STM32F769NIH6 Description

The STM32F765xx, STM32F767xx, STM32F768Ax and STM32F769xx devices are based on the high-performance Arm® Cortex®-M7 32-bit RISC core operating at up to 216 MHz frequency. The Cortex®-M7 core features a floating point unit (FPU) which supports Arm® double-precision and single-precision data-processing instructions and data types. It also
implements a full set of DSP instructions and a memory protection unit (MPU) which enhances the application security.
The STM32F765xx, STM32F767xx, STM32F768Ax and STM32F769xx devices incorporate high-speed embedded memories with a Flash memory up to 2 Mbytes, 512 Kbytes of SRAM (including 128 Kbytes of Data TCM RAM for critical real-time data), 16 Kbytes of instruction TCM RAM (for critical real-time routines), 4 Kbytes of backup SRAM available in the lowest power modes, and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB buses, a 32-bit multi-AHB bus matrix and a multi layer AXI interconnect supporting internal and external memories access.

STM32F769NIH6 Features

• Core: Arm® 32-bit Cortex®-M7 CPU with DPFPU, ART Accelerator and L1-cache: 16 Kbytes I/D cache, allowing 0-wait state execution from embedded Flash and external memories, up to 216 MHz, MPU, 462 DMIPS/2.14 DMIPS/MHz (Dhrystone 2.1), and DSP instructions.
• Memories
– Up to 2 Mbytes of Flash memory organized into two banks allowing read-while- write
– SRAM: 512 Kbytes (including 128 Kbytes of data TCM RAM for critical real- time data)
+ 16 Kbytes of instruction TCM RAM (for critical real-time routines) + 4 Kbytes of backup SRAM
– Flexible external memory controller with up to 32-bit data bus: SRAM, PSRAM, SDRAM/LPSDR SDRAM, NOR/NAND
memories
• Dual mode Quad-SPI
• Graphics
– Chrom-ART Accelerator (DMA2D), graphical hardware accelerator enabling enhanced graphical user interface
– Hardware JPEG codec
– LCD-TFT controller supporting up to XGA resolution
– MIPI® DSI host controller supporting up to 720p 30 Hz resolution
• Clock, reset and supply management
– 1.7 V to 3.6 V application supply and I/Os
– POR, PDR, PVD and BOR
– Dedicated USB power
– 4-to-26 MHz crystal oscillator
– Internal 16 MHz factory-trimmed RC (1% accuracy)
– 32 kHz oscillator for RTC with calibration
– Internal 32 kHz RC with calibration
Low-power
– Sleep, Stop and Standby modes
– VBAT supply for RTC, 32×32 bit backup
registers + 4 Kbytes backup SRAM
• 3×12-bit, 2.4 MSPS ADC: up to 24 channels
• Digital filters for sigma delta modulator (DFSDM), 8 channels / 4 filters
• 2×12-bit D/A converters
• General-purpose DMA: 16-stream DMA controller with FIFOs and burst support
• Up to 18 timers: up to thirteen 16-bit (1x lowpower 16-bit timer available in Stop mode) and two 32-bit timers, each with up to 4 IC/OC/PWM or pulse counter and quadrature
(incremental) encoder input. All 15 timers running up to 216 MHz. 2x watchdogs, SysTick timer
• Debug mode
– SWD and JTAG interfaces
– Cortex®-M7 Trace Macrocell™
• Up to 168 I/O ports with interrupt capability
– Up to 164 fast I/Os up to 108 MHz
– Up to 166 5 V-tolerant I/Os