Description

The 448153-1 is a D-Sub Connector Housing electronic component model designed for high pin-count devices or memory modules mounted on mezzanine or module PC Boards (PCBs). It features a SEARAY board-to-board connector with superior electrical and mechanical features, cost competitiveness, and a unique patented solder charge technology resulting in better process yields and lower costs compared to BGA connector products. The circuit sizes range from 160 through 500 positions, and the mated stack heights cover 7mm to 13mm.

Specifications and features

• Unique patented solder attach that is more cost-effective and reliable than BGA connectors
• SEARAY footprint compatible with other 1.27mm by 1.27mm products
• Robust guidance and polarization for correct mating position
• Advanced gold-plated housings with integrated shielding system
• Two points of contact on each signal
• Multiple stack heights available from 10mm to 25mm
• Available in differential pair sizes of 6, 12, 24, and 36
• Up to 32mm board-to-board stack heights
• Designed for parallel board packaging, mezzanine cards, parallel backplanes, and bridge board applications
• Surface Mount Compatible
• High-density 2.00mm metric connector in the same form factor as Future bus
• Designed for high-density, high-speed applications
• Economical design for 50 and 100 Ohm applications

Application Scenarios

The 448153-1 D-Sub Connector Housing is widely used in various industries and applications, including:

• Computer and server systems
• Medical scanning equipment
• Military applications
• Network routers and switches
• Mobile base stations and phones
• Digital cameras and players
• Notebook PCs and compact applications
• Telecom and broadcast equipment
• Vending and gaming machines
• Industrial instruments
• Energy and power devices
• Business machines and computer peripherals
• Consumer electronics
• And many more

Comparison

• Unique patented solder attach technology
• Compatibility with other 1.27mm by 1.27mm products
• Robust guidance and polarization for correct mating position
• Advanced gold-plated housings with integrated shielding system
• Multiple stack heights available for design flexibility
• Economical design for 50 and 100 Ohm applications
• Surface Mount Compatible

• May not be suitable for low pin-count devices or small form factor applications
• Requires careful consideration of board-to-board stack heights