Description

This document contains the specifications for the Intel® Advanced+ Boot Block Flash Memory (C3) Stacked Chip Scale Package (SCSP) device. C3 SCSP memory solutions are offered in different combinations such as 32-Mbit flash + 8-Mbit SRAM, 32-Mbit flash + 4-Mbit SRAM, 16-Mbit flash + 4-Mbit SRAM, and 16-Mbit flash memory + 2-Mbit SRAM. The C3 SCSP device combines flash memory and SRAM into a single package, providing secure low-voltage memory solutions for portable applications.

Specifications and features

The flash memory of the C3 SCSP device offers enhanced security, instant locking/unlocking of any flash block with zero-latency, and a 128-bit protection register for unique device identification. It also improves 12V production programming for increased factory throughput and reduces memory board space required, simplifying PCB design complexity. The SCSP technology ensures the smallest memory subsystem footprint and advanced SRAM technology provides 70 ns access time, low power operation, and low voltage data retention mode. The device also includes Intel® Flash Data Integrator (FDI) software for real-time data storage and code execution in the same memory device, as well as full flash file manager capability. The Advanced+ Boot Block Flash Memory has a blocking architecture with different block sizes for code + data storage, 100,000 erase cycles per block, and operates at extended temperatures (-25 °C to +85 °C). The flash memory utilizes different flash technologies such as 0.25 µm ETOX™ VI, 0.18 µm ETOX™ VII, and 0.13 µm ETOX™ VIII.

Application Scenarios

The C3 SCSP device is designed for use in various portable applications that require secure low-voltage memory solutions. It is suitable for applications where space on the memory board is limited and where advanced SRAM technology and blocking architecture are needed. The device is also ideal for applications that require real-time data storage and code execution in the same memory device, along with full flash file manager capability.

Comparison

- The C3 SCSP device combines flash memory and SRAM into a single package, providing a compact memory solution with enhanced security features.
- The flash memory has instant locking/unlocking of any block with zero-latency, ensuring secure data storage.
- The device offers a 128-bit protection register for unique device identification, meeting the needs of next-generation portable applications.
- Improved 12V production programming allows for increased factory throughput.
- The blocking architecture of the flash memory ensures efficient code and data storage.
- The device operates at extended temperature ranges (-25 °C to +85 °C), making it suitable for a variety of applications.

- The device is available in limited combinations of flash memory and SRAM, which may not meet the specific requirements of all applications.
- The C3 SCSP device requires careful PCB design to ensure proper integration and minimize design complexity.
- The device requires the use of Intel® Flash Data Integrator (FDI) software for full functionality, which may limit compatibility with other software systems.