215BCFAKA14FG

FEATURES

■ Package:
• 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm
■ Commercial, Industrial and Military Temperature Ranges
■ Weight:
• WEDPNF8M721V-XBX - 2.5 grams typical

SDRAM PERFORMANCE FEATURES

■ Organized as 8M x 72
■ High Frequency = 100, 125MHz
■ Single 3.3V ±0.3V power supply
■ Fully Synchronous; all signals registered on positive edge of system clock cycle
■ Internal pipelined operation; column address can be changed every clock cycle
■ Internal banks for hiding row access/precharge
■ Programmable Burst length 1,2,4,8 or full page
■ 4096 refresh cycles

FLASH PERFORMANCE FEATURES

■ User Configurable as 1Mx8 or 512Kx16
■ Access Times of 100, 120, 150ns
■ 3.3 Volt for Read and Write Operations
■ 1,000,000 Erase/Program Cycles
■ Sector Architecture
• One 16KByte, two 8KBytes, one 32KByte, and fif teen 64KBytes in byte mode
• One 8K word, two 4K words, one 16K word, and fifteen 32K word sectors in word mode.
• Any combination of sectors can be concurrently erased. Also supports full chip erase
■ Boot Code Sector Architecture (Bottom)
■ Embedded Erase and Program Algorithms
■ Erase Suspend/Resume
• Supports reading data from or programing data to a sector not being erased

BENEFITS

■ 42% SPACE SAVINGS
■ Reduced part count
■ Reduced I/O count
• 14% I/O Reduction
■ Suitable for hi-reliability applications
■ SDRAM Upgradeable to 16M x 72 density (contact factory for information)
■ Flash upgradeable to 2M x 8 (or 1M x 16 or 512K x 32) density